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Journal description
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Details for article 3 of 26 found articles
| Title: |
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging |
| Author: |
Khor, C.Y. Abdullah, M.Z. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 53 (2013) nr. 2 pages 14 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 26 found articles
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