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                                       Details for article 3 of 26 found articles
 
 
  Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging
 
 
Title: Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging
Author: Khor, C.Y.
Abdullah, M.Z.
Appeared in: Microelectronics reliability
Paging: Volume 53 (2013) nr. 2 pages 14 p.
Year: 2013
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 26 found articles
 
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