nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Alloying modification of Sn–Ag–Cu solders by manganese and titanium
|
Lin, Li-Wei |
|
2009 |
49 |
3 |
p. 235-241 7 p. |
artikel |
2 |
Development of gold based solder candidates for flip chip assembly
|
Chidambaram, Vivek |
|
2009 |
49 |
3 |
p. 323-330 8 p. |
artikel |
3 |
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
|
Laurila, T. |
|
2009 |
49 |
3 |
p. 242-247 6 p. |
artikel |
4 |
High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys
|
Jenq, S.T. |
|
2009 |
49 |
3 |
p. 310-317 8 p. |
artikel |
5 |
Inside front cover - Editorial board
|
|
|
2009 |
49 |
3 |
p. IFC- 1 p. |
artikel |
6 |
Interfacial fracture toughness of Pb-free solders
|
Hayes, S.M. |
|
2009 |
49 |
3 |
p. 269-287 19 p. |
artikel |
7 |
Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders
|
Zhang, Ruihong |
|
2009 |
49 |
3 |
p. 303-309 7 p. |
artikel |
8 |
Investigation of delamination control in plastic package
|
Zhao, Shufeng |
|
2009 |
49 |
3 |
p. 350-356 7 p. |
artikel |
9 |
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
|
Wang, Y.W. |
|
2009 |
49 |
3 |
p. 248-252 5 p. |
artikel |
10 |
Mechanical properties versus temperature relation of individual phases in Sn–3.0Ag–0.5Cu lead-free solder alloy
|
Gao, Feng |
|
2009 |
49 |
3 |
p. 296-302 7 p. |
artikel |
11 |
Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops: Effect of packaging
|
Ghisi, Aldo |
|
2009 |
49 |
3 |
p. 340-349 10 p. |
artikel |
12 |
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
|
Chao, Brook Huang-Lin |
|
2009 |
49 |
3 |
p. 253-263 11 p. |
artikel |
13 |
Recent research advances in Pb-free solders
|
Lai, Yi-Shao |
|
2009 |
49 |
3 |
p. 221-222 2 p. |
artikel |
14 |
Research advances in nano-composite solders
|
Shen, J. |
|
2009 |
49 |
3 |
p. 223-234 12 p. |
artikel |
15 |
Solder-joint reliability of HVQFN-packages subjected to thermal cycling
|
de Vries, J. |
|
2009 |
49 |
3 |
p. 331-339 9 p. |
artikel |
16 |
The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
|
Seo, Sun-Kyoung |
|
2009 |
49 |
3 |
p. 288-295 8 p. |
artikel |
17 |
The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
|
Wu, Albert T. |
|
2009 |
49 |
3 |
p. 318-322 5 p. |
artikel |
18 |
Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases
|
Chen, Jiunn |
|
2009 |
49 |
3 |
p. 264-268 5 p. |
artikel |