|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 9 of 18 found articles
| Title: |
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates |
| Author: |
Wang, Y.W. Lin, Y.W. Kao, C.R. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 3 pages 5 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 18 found articles
| << previous | next >> |