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Journal description
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Details for article 4 of 18 found articles
| Title: |
High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys |
| Author: |
Jenq, S.T. Chang, Hsuan-Hu Lai, Yi-Shao Tsai, Tsung-Yueh |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 3 pages 8 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 18 found articles
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