| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Alloying modification of Sn–Ag–Cu solders by manganese and titanium
|
Lin, Li-Wei
|
|
2009
|
49 |
3 |
p. 235-241
7 p.
|
article
|
| 2 |
Development of gold based solder candidates for flip chip assembly
|
Chidambaram, Vivek
|
|
2009
|
49 |
3 |
p. 323-330
8 p.
|
article
|
| 3 |
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
|
Laurila, T.
|
|
2009
|
49 |
3 |
p. 242-247
6 p.
|
article
|
| 4 |
High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys
|
Jenq, S.T.
|
|
2009
|
49 |
3 |
p. 310-317
8 p.
|
article
|
| 5 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
3 |
p. IFC-
1 p.
|
article
|
| 6 |
Interfacial fracture toughness of Pb-free solders
|
Hayes, S.M.
|
|
2009
|
49 |
3 |
p. 269-287
19 p.
|
article
|
| 7 |
Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders
|
Zhang, Ruihong
|
|
2009
|
49 |
3 |
p. 303-309
7 p.
|
article
|
| 8 |
Investigation of delamination control in plastic package
|
Zhao, Shufeng
|
|
2009
|
49 |
3 |
p. 350-356
7 p.
|
article
|
| 9 |
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
|
Wang, Y.W.
|
|
2009
|
49 |
3 |
p. 248-252
5 p.
|
article
|
| 10 |
Mechanical properties versus temperature relation of individual phases in Sn–3.0Ag–0.5Cu lead-free solder alloy
|
Gao, Feng
|
|
2009
|
49 |
3 |
p. 296-302
7 p.
|
article
|
| 11 |
Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops: Effect of packaging
|
Ghisi, Aldo
|
|
2009
|
49 |
3 |
p. 340-349
10 p.
|
article
|
| 12 |
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
|
Chao, Brook Huang-Lin
|
|
2009
|
49 |
3 |
p. 253-263
11 p.
|
article
|
| 13 |
Recent research advances in Pb-free solders
|
Lai, Yi-Shao
|
|
2009
|
49 |
3 |
p. 221-222
2 p.
|
article
|
| 14 |
Research advances in nano-composite solders
|
Shen, J.
|
|
2009
|
49 |
3 |
p. 223-234
12 p.
|
article
|
| 15 |
Solder-joint reliability of HVQFN-packages subjected to thermal cycling
|
de Vries, J.
|
|
2009
|
49 |
3 |
p. 331-339
9 p.
|
article
|
| 16 |
The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging
|
Seo, Sun-Kyoung
|
|
2009
|
49 |
3 |
p. 288-295
8 p.
|
article
|
| 17 |
The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
|
Wu, Albert T.
|
|
2009
|
49 |
3 |
p. 318-322
5 p.
|
article
|
| 18 |
Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases
|
Chen, Jiunn
|
|
2009
|
49 |
3 |
p. 264-268
5 p.
|
article
|
Journal description