| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advances in the drop-impact reliability of solder joints for mobile applications
|
Wong, E.H.
|
|
2009
|
49 |
2 |
p. 139-149
11 p.
|
artikel
|
| 2 |
A low-frequency noise model for advanced gate-stack MOSFETs
|
Çelik-Butler, Zeynep
|
|
2009
|
49 |
2 |
p. 103-112
10 p.
|
artikel
|
| 3 |
A new on-chip test structure for real time fatigue analysis in polysilicon MEMS
|
Langfelder, G.
|
|
2009
|
49 |
2 |
p. 120-126
7 p.
|
artikel
|
| 4 |
A new two-dimensional analytical subthreshold behavior model for short-channel tri-material gate-stack SOI MOSFET’s
|
Chiang, Te-Kuang
|
|
2009
|
49 |
2 |
p. 113-119
7 p.
|
artikel
|
| 5 |
Calendar
|
|
|
2009
|
49 |
2 |
p. I-IV
nvt p.
|
artikel
|
| 6 |
Charging control on high energy implanters: A process requirement demonstrated by plasma damage monitoring
|
Cantin, C.
|
|
2009
|
49 |
2 |
p. 209-214
6 p.
|
artikel
|
| 7 |
Evolutionary derivation of optimal test sets for neural network based analog and mixed signal circuits fault diagnosis approach
|
Seyyed Mahdavi, S.J.
|
|
2009
|
49 |
2 |
p. 199-208
10 p.
|
artikel
|
| 8 |
Experimental and simulation studies of resistivity in nanoscale copper films
|
Emre Yarimbiyik, A.
|
|
2009
|
49 |
2 |
p. 127-134
8 p.
|
artikel
|
| 9 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
2 |
p. IFC-
1 p.
|
artikel
|
| 10 |
Interconnect crosstalk noise evaluation in deep-submicron technologies
|
Liu, Xiaoxiao
|
|
2009
|
49 |
2 |
p. 170-177
8 p.
|
artikel
|
| 11 |
Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink
|
Yang, Yue-Tzu
|
|
2009
|
49 |
2 |
p. 163-169
7 p.
|
artikel
|
| 12 |
Multi-valued logic mapping of resistive short and open delay-fault testing in deep sub-micron technologies
|
Javaheri, Reza
|
|
2009
|
49 |
2 |
p. 178-185
8 p.
|
artikel
|
| 13 |
New concepts of worst-case delay and yield estimation in asynchronous VLSI circuits
|
Sokolović, Miljana
|
|
2009
|
49 |
2 |
p. 186-198
13 p.
|
artikel
|
| 14 |
Reliability improvements in 50nm MLC NAND flash memory using short voltage programming pulses
|
Irrera, Fernanda
|
|
2009
|
49 |
2 |
p. 135-138
4 p.
|
artikel
|
| 15 |
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
|
Ong, Xuefen
|
|
2009
|
49 |
2 |
p. 150-162
13 p.
|
artikel
|
| 16 |
Verification and reduction of surface charging during high/medium current implantations by implementing plasma damage monitoring
|
Cantin, C.
|
|
2009
|
49 |
2 |
p. 215-220
6 p.
|
artikel
|
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