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Journal description
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Details for article 15 of 16 found articles
| Title: |
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages |
| Author: |
Ong, Xuefen Ho, Soon Wee Ong, Yue Ying Wai, Leong Ching Vaidyanathan, Kripesh Lim, Yeow Kheng Yeo, David Chan, Kai Chong Tan, Juan Boon Sohn, Dong Kyun Hsia, Liang Choo Chen, Zhong |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 2 pages 13 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 16 found articles
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