| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An investigation of Sn pest in pure Sn and Sn-based solders
|
Peng, Weiqun
|
|
2009
|
49 |
1 |
p. 86-91
6 p.
|
artikel
|
| 2 |
A simple estimation of transverse response of high-g accelerometers by a free-drop-bar method
|
Bao, Haifei
|
|
2009
|
49 |
1 |
p. 66-73
8 p.
|
artikel
|
| 3 |
A study on the performance and reliability of magnetostatic actuated RF MEMS switches
|
Lin, Ta-Hsuan
|
|
2009
|
49 |
1 |
p. 59-65
7 p.
|
artikel
|
| 4 |
Calendar
|
|
|
2009
|
49 |
1 |
p. I-
1 p.
|
artikel
|
| 5 |
Drain current saturation at high drain voltage due to pinch off instead of velocity saturation in sub-100nm metal–oxide–semiconductor transistors
|
Lau, W.S.
|
|
2009
|
49 |
1 |
p. 1-7
7 p.
|
artikel
|
| 6 |
Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact
|
Liu, Fang
|
|
2009
|
49 |
1 |
p. 79-85
7 p.
|
artikel
|
| 7 |
Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
|
Born, V.
|
|
2009
|
49 |
1 |
p. 74-78
5 p.
|
artikel
|
| 8 |
Hot-carrier reliability and breakdown characteristics of multi-finger RF MOS transistors
|
Wong, H.
|
|
2009
|
49 |
1 |
p. 13-16
4 p.
|
artikel
|
| 9 |
Influence of medical sterilization on ACA flip chip joints using conformal coating
|
Kokko, Kati
|
|
2009
|
49 |
1 |
p. 92-98
7 p.
|
artikel
|
| 10 |
Inside front cover - Editorial board
|
|
|
2009
|
49 |
1 |
p. IFC-
1 p.
|
artikel
|
| 11 |
New substrate-triggered ESD protection structures in a 0.18-μm CMOS process without extra mask
|
Shan, Yi
|
|
2009
|
49 |
1 |
p. 17-25
9 p.
|
artikel
|
| 12 |
Physical phenomena affecting performance and reliability of 4H–SiC bipolar junction transistors
|
Muzykov, Peter G.
|
|
2009
|
49 |
1 |
p. 32-37
6 p.
|
artikel
|
| 13 |
Reliability assessment of 1.55-μm vertical cavity surface emitting lasers with tunnel junction using high-temperature aging tests
|
Rhew, Keun Ho
|
|
2009
|
49 |
1 |
p. 42-50
9 p.
|
artikel
|
| 14 |
RF device package method using Au to Au direct bonding technology
|
Kwon, Sangwook
|
|
2009
|
49 |
1 |
p. 99-102
4 p.
|
artikel
|
| 15 |
Stability of thin film resistors – Prediction and differences base on time-dependent Arrhenius law
|
Kuehl, Reiner W.
|
|
2009
|
49 |
1 |
p. 51-58
8 p.
|
artikel
|
| 16 |
Study of stress-induced leakage current (SILC) in HfO2/Dy2O3 high-κ gate stacks on germanium
|
Rahman, M.S.
|
|
2009
|
49 |
1 |
p. 26-31
6 p.
|
artikel
|
| 17 |
Temperature-dependent light-emitting characteristics of InGaN/GaN diodes
|
Liu, Jun
|
|
2009
|
49 |
1 |
p. 38-41
4 p.
|
artikel
|
| 18 |
Two-stage hot-carrier degradation behavior of 0.18μm 18V n-type DEMOS and its recovery effect
|
Gao, Chao
|
|
2009
|
49 |
1 |
p. 8-12
5 p.
|
artikel
|
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