nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An investigation of Sn pest in pure Sn and Sn-based solders
|
Peng, Weiqun |
|
2009 |
49 |
1 |
p. 86-91 6 p. |
artikel |
2 |
A simple estimation of transverse response of high-g accelerometers by a free-drop-bar method
|
Bao, Haifei |
|
2009 |
49 |
1 |
p. 66-73 8 p. |
artikel |
3 |
A study on the performance and reliability of magnetostatic actuated RF MEMS switches
|
Lin, Ta-Hsuan |
|
2009 |
49 |
1 |
p. 59-65 7 p. |
artikel |
4 |
Calendar
|
|
|
2009 |
49 |
1 |
p. I- 1 p. |
artikel |
5 |
Drain current saturation at high drain voltage due to pinch off instead of velocity saturation in sub-100nm metal–oxide–semiconductor transistors
|
Lau, W.S. |
|
2009 |
49 |
1 |
p. 1-7 7 p. |
artikel |
6 |
Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact
|
Liu, Fang |
|
2009 |
49 |
1 |
p. 79-85 7 p. |
artikel |
7 |
Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
|
Born, V. |
|
2009 |
49 |
1 |
p. 74-78 5 p. |
artikel |
8 |
Hot-carrier reliability and breakdown characteristics of multi-finger RF MOS transistors
|
Wong, H. |
|
2009 |
49 |
1 |
p. 13-16 4 p. |
artikel |
9 |
Influence of medical sterilization on ACA flip chip joints using conformal coating
|
Kokko, Kati |
|
2009 |
49 |
1 |
p. 92-98 7 p. |
artikel |
10 |
Inside front cover - Editorial board
|
|
|
2009 |
49 |
1 |
p. IFC- 1 p. |
artikel |
11 |
New substrate-triggered ESD protection structures in a 0.18-μm CMOS process without extra mask
|
Shan, Yi |
|
2009 |
49 |
1 |
p. 17-25 9 p. |
artikel |
12 |
Physical phenomena affecting performance and reliability of 4H–SiC bipolar junction transistors
|
Muzykov, Peter G. |
|
2009 |
49 |
1 |
p. 32-37 6 p. |
artikel |
13 |
Reliability assessment of 1.55-μm vertical cavity surface emitting lasers with tunnel junction using high-temperature aging tests
|
Rhew, Keun Ho |
|
2009 |
49 |
1 |
p. 42-50 9 p. |
artikel |
14 |
RF device package method using Au to Au direct bonding technology
|
Kwon, Sangwook |
|
2009 |
49 |
1 |
p. 99-102 4 p. |
artikel |
15 |
Stability of thin film resistors – Prediction and differences base on time-dependent Arrhenius law
|
Kuehl, Reiner W. |
|
2009 |
49 |
1 |
p. 51-58 8 p. |
artikel |
16 |
Study of stress-induced leakage current (SILC) in HfO2/Dy2O3 high-κ gate stacks on germanium
|
Rahman, M.S. |
|
2009 |
49 |
1 |
p. 26-31 6 p. |
artikel |
17 |
Temperature-dependent light-emitting characteristics of InGaN/GaN diodes
|
Liu, Jun |
|
2009 |
49 |
1 |
p. 38-41 4 p. |
artikel |
18 |
Two-stage hot-carrier degradation behavior of 0.18μm 18V n-type DEMOS and its recovery effect
|
Gao, Chao |
|
2009 |
49 |
1 |
p. 8-12 5 p. |
artikel |