| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Acceleration factors for THB induced degradation of AlGaAs/InGaAs pHEMT devices
|
Marchut, Leslie
|
|
2008
|
48 |
7 |
p. 990-993
4 p.
|
artikel
|
| 2 |
A wafer-level approach to device lifetesting
|
Hamada, Dorothy June M.
|
|
2008
|
48 |
7 |
p. 985-989
5 p.
|
artikel
|
| 3 |
Calendar
|
|
|
2008
|
48 |
7 |
p. I-III
nvt p.
|
artikel
|
| 4 |
Correlation studies for component level ball impact shear test and board level drop test
|
Wong, E.H.
|
|
2008
|
48 |
7 |
p. 1069-1078
10 p.
|
artikel
|
| 5 |
3D thermal model to investigate component displacement phenomenon during reflow soldering
|
Illés, Balázs
|
|
2008
|
48 |
7 |
p. 1062-1068
7 p.
|
artikel
|
| 6 |
Editorial
|
Ersland, Peter
|
|
2008
|
48 |
7 |
p. 957-
1 p.
|
artikel
|
| 7 |
Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders
|
Chen, Cheng-fu
|
|
2008
|
48 |
7 |
p. 1040-1051
12 p.
|
artikel
|
| 8 |
Estimating effective dielectric thickness for capacitors with extrinsic defects by a statistical method
|
Whitman, Charles S.
|
|
2008
|
48 |
7 |
p. 965-973
9 p.
|
artikel
|
| 9 |
Evaluation of RF electrostatic discharge (ESD) protection in 0.18-μm CMOS technology
|
Du, Xiaoyang
|
|
2008
|
48 |
7 |
p. 995-999
5 p.
|
artikel
|
| 10 |
Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films
|
Lin, Chao-Ming
|
|
2008
|
48 |
7 |
p. 1087-1092
6 p.
|
artikel
|
| 11 |
Forensic characterization of thin film resistor degradation
|
Roesch, William J.
|
|
2008
|
48 |
7 |
p. 958-964
7 p.
|
artikel
|
| 12 |
Impact of bias condition on 1/f noise of dual-gate depletion type MOSFET in linear region and consequences for noise diagnostic application and modelling
|
Videnovic-Misic, M.
|
|
2008
|
48 |
7 |
p. 1008-1014
7 p.
|
artikel
|
| 13 |
Inside front cover - Editorial board
|
|
|
2008
|
48 |
7 |
p. IFC-
1 p.
|
artikel
|
| 14 |
Intrinsic reliability of a 12V field plate pHEMT
|
Gaw, Craig
|
|
2008
|
48 |
7 |
p. 974-984
11 p.
|
artikel
|
| 15 |
Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
|
Chin, Y.T.
|
|
2008
|
48 |
7 |
p. 1079-1086
8 p.
|
artikel
|
| 16 |
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications
|
Jang, Kyung-Woon
|
|
2008
|
48 |
7 |
p. 1052-1061
10 p.
|
artikel
|
| 17 |
Noise and reliability in simulated thin metal films
|
Pascoli, Stefano Di
|
|
2008
|
48 |
7 |
p. 1015-1020
6 p.
|
artikel
|
| 18 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
7 |
p. 1106-1107
2 p.
|
artikel
|
| 19 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
7 |
p. 1108-1109
2 p.
|
artikel
|
| 20 |
Pressure-induced tin whisker formation
|
Shibutani, Tadahiro
|
|
2008
|
48 |
7 |
p. 1033-1039
7 p.
|
artikel
|
| 21 |
Simulation of transient thermal states in layered electronic microstructures
|
Kalita, Włodzimierz
|
|
2008
|
48 |
7 |
p. 1021-1026
6 p.
|
artikel
|
| 22 |
Temperature dependence of electrical parameters of SMD ferrite components for EMI suppression
|
Stojanović, Goran
|
|
2008
|
48 |
7 |
p. 1027-1032
6 p.
|
artikel
|
| 23 |
Test generation at the algorithm-level for gate-level fault coverage
|
Bareisa, Eduardas
|
|
2008
|
48 |
7 |
p. 1093-1101
9 p.
|
artikel
|
| 24 |
Total ionizing dose effects in shallow trench isolation oxides
|
Faccio, Federico
|
|
2008
|
48 |
7 |
p. 1000-1007
8 p.
|
artikel
|
| 25 |
Yield challenges in wafer stacking technology
|
Kim, Eun-Kyung
|
|
2008
|
48 |
7 |
p. 1102-1105
4 p.
|
artikel
|
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