| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fringing-capacitance model for deep-submicron MOSFET with high-k gate dielectric
|
Ji, F.
|
|
2008
|
48 |
5 |
p. 693-697
5 p.
|
artikel
|
| 2 |
Analysis and test procedures for NOR flash memory defects
|
Mohammad, Mohammad Gh.
|
|
2008
|
48 |
5 |
p. 698-709
12 p.
|
artikel
|
| 3 |
Bulk built in current sensors for single event transient detection in deep-submicron technologies
|
Wirth, Gilson
|
|
2008
|
48 |
5 |
p. 710-715
6 p.
|
artikel
|
| 4 |
Calendar
|
|
|
2008
|
48 |
5 |
p. I-III
nvt p.
|
artikel
|
| 5 |
Call for Papers - ROCS 2008 Workshop
|
|
|
2008
|
48 |
5 |
p. IV-
1 p.
|
artikel
|
| 6 |
Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages
|
Park, S.B.
|
|
2008
|
48 |
5 |
p. 763-772
10 p.
|
artikel
|
| 7 |
Coupling capacitances in the planar conductive path system of the hybrid circuit with dielectric layer
|
Wisz, Bogusław
|
|
2008
|
48 |
5 |
p. 724-733
10 p.
|
artikel
|
| 8 |
Dependency of thermal spreading resistance on convective heat transfer coefficient
|
Vermeersch, B.
|
|
2008
|
48 |
5 |
p. 734-738
5 p.
|
artikel
|
| 9 |
Effect of a trace of water vapor on Ohmic contact formation for AlGaN/GaN epitaxial wafers
|
Lau, W.S.
|
|
2008
|
48 |
5 |
p. 794-797
4 p.
|
artikel
|
| 10 |
Highly reliable processes for embedding discrete passive components into organic substrates
|
Cho, Han Seo
|
|
2008
|
48 |
5 |
p. 739-743
5 p.
|
artikel
|
| 11 |
Modified Engelmaier’s model taking account of different stress levels
|
Salmela, Olli
|
|
2008
|
48 |
5 |
p. 773-780
8 p.
|
artikel
|
| 12 |
No-fault-found and intermittent failures in electronic products
|
Qi, Haiyu
|
|
2008
|
48 |
5 |
p. 663-674
12 p.
|
artikel
|
| 13 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
5 |
p. 798-799
2 p.
|
artikel
|
| 14 |
[No title]
|
Stojcev, Mile
|
|
2008
|
48 |
5 |
p. 800-801
2 p.
|
artikel
|
| 15 |
On improving training time of neural networks in mixed signal circuit fault diagnosis applications
|
Mohammadi, K.
|
|
2008
|
48 |
5 |
p. 781-793
13 p.
|
artikel
|
| 16 |
Reliability of ultra thin ZrO2 films on strained-Si
|
Bera, M.K.
|
|
2008
|
48 |
5 |
p. 682-692
11 p.
|
artikel
|
| 17 |
Stress intensities at the triple junction of a multilevel thin film package
|
Jeon, Insu
|
|
2008
|
48 |
5 |
p. 749-756
8 p.
|
artikel
|
| 18 |
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages
|
Tsai, Tsung-Yueh
|
|
2008
|
48 |
5 |
p. 757-762
6 p.
|
artikel
|
| 19 |
The mechanical stress resistance capability of stress buffer structures in analog devices
|
Ku, Hsiao-Tung
|
|
2008
|
48 |
5 |
p. 716-723
8 p.
|
artikel
|
| 20 |
The role of dissolved hydrogen and other trace impurities on propensity of tin deposits to grow whiskers
|
Pinsky, David A.
|
|
2008
|
48 |
5 |
p. 675-681
7 p.
|
artikel
|
| 21 |
The self-formatting barrier characteristics of Cu–Mg/SiO2 and Cu–Ru/SiO2 films for Cu interconnects
|
Yi, Seol-Min
|
|
2008
|
48 |
5 |
p. 744-748
5 p.
|
artikel
|
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