nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Angle-resolved photoelectron spectroscopy on gate insulators
|
Hattori, T. |
|
2007 |
47 |
1 |
p. 20-26 7 p. |
artikel |
2 |
A review of the use of electro-thermal simulations for the analysis of heterostructure FETs
|
Sozzi, Giovanna |
|
2007 |
47 |
1 |
p. 65-73 9 p. |
artikel |
3 |
A voltage calibration technique of electro-optic probing for characterization internal to IC’s chip
|
Liu, Hongfei |
|
2007 |
47 |
1 |
p. 82-87 6 p. |
artikel |
4 |
Characterization and modeling of flicker noise in junction field-effect transistor with source and drain trench isolation
|
Fu, Y. |
|
2007 |
47 |
1 |
p. 46-50 5 p. |
artikel |
5 |
Comparative analysis of RF LDMOS capacitance reliability under accelerated ageing tests
|
Belaïd, M.A. |
|
2007 |
47 |
1 |
p. 59-64 6 p. |
artikel |
6 |
Computational modelling for reliable flip-chip packaging at sub-100μm pitch using isotropic conductive adhesives
|
Stoyanov, S. |
|
2007 |
47 |
1 |
p. 132-141 10 p. |
artikel |
7 |
Cyclic bending reliability of wafer-level chip-scale packages
|
Lai, Yi-Shao |
|
2007 |
47 |
1 |
p. 111-117 7 p. |
artikel |
8 |
Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints
|
Lee, J.G. |
|
2007 |
47 |
1 |
p. 118-131 14 p. |
artikel |
9 |
Modeling current transport in ultra-scaled field-effect transistors
|
Sverdlov, V. |
|
2007 |
47 |
1 |
p. 11-19 9 p. |
artikel |
10 |
N-MOSFET oxide trap characterization induced by nitridation process using RTS noise analysis
|
Leyris, C. |
|
2007 |
47 |
1 |
p. 41-45 5 p. |
artikel |
11 |
[No title]
|
Stojcev, Mile |
|
2007 |
47 |
1 |
p. 157-158 2 p. |
artikel |
12 |
[No title]
|
Tosic, Milorad |
|
2007 |
47 |
1 |
p. 155-156 2 p. |
artikel |
13 |
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages
|
Lai, Yi-Shao |
|
2007 |
47 |
1 |
p. 104-110 7 p. |
artikel |
14 |
Overview on ESD protection design for mixed-voltage I/O interfaces with high-voltage-tolerant power-rail ESD clamp circuits in low-voltage thin-oxide CMOS technology
|
Ker, Ming-Dou |
|
2007 |
47 |
1 |
p. 27-35 9 p. |
artikel |
15 |
Reconfigurable digital controller for a buck converter based on FPGA
|
Milanovic, Miro |
|
2007 |
47 |
1 |
p. 150-154 5 p. |
artikel |
16 |
Sample tilting technique for preventing electrostatic discharge during high-current FIB gas-assisted etching with XeF2
|
Komoda, Hirotaka |
|
2007 |
47 |
1 |
p. 74-81 8 p. |
artikel |
17 |
Silicon integrated photonics begins to revolutionize
|
Wong, Hei |
|
2007 |
47 |
1 |
p. 1-10 10 p. |
artikel |
18 |
Single band electronic conduction in hafnium oxide prepared by atomic layer deposition
|
Shaimeev, Sergey |
|
2007 |
47 |
1 |
p. 36-40 5 p. |
artikel |
19 |
Study of the electrical cycling stressed large area Schottky diodes using I–V and noise measurements
|
Jevtić, Milan M. |
|
2007 |
47 |
1 |
p. 51-58 8 p. |
artikel |
20 |
Test methodology for durability estimation of surface mount interconnects under drop testing conditions
|
Varghese, J. |
|
2007 |
47 |
1 |
p. 93-103 11 p. |
artikel |
21 |
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth
|
Fukuda, Yuki |
|
2007 |
47 |
1 |
p. 88-92 5 p. |
artikel |
22 |
Using neural networks as a fault detection mechanism in MEMS devices
|
Asgary, Reza |
|
2007 |
47 |
1 |
p. 142-149 8 p. |
artikel |