nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A fault-tolerant cache architecture based on binary set partitioning
|
Zarandi, Hamid R. |
|
2006 |
46 |
1 |
p. 86-99 14 p. |
artikel |
2 |
Algorithm for automatic alignment in 2D space by object transformation
|
Kim, Hyong Tae |
|
2006 |
46 |
1 |
p. 100-108 9 p. |
artikel |
3 |
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
|
Wu, J.D. |
|
2006 |
46 |
1 |
p. 41-52 12 p. |
artikel |
4 |
Damped transient power clamps for improved ESD protection of CMOS
|
Hunter, Bradford L. |
|
2006 |
46 |
1 |
p. 77-85 9 p. |
artikel |
5 |
EBSD measurements of elastic strain fields in a GaN/sapphire structure
|
Luo, J.F. |
|
2006 |
46 |
1 |
p. 178-182 5 p. |
artikel |
6 |
Effect of reverse substrate bias on ultra-thin gate oxide n-MOSFET degradation under different stress modes
|
Zhao, Yao |
|
2006 |
46 |
1 |
p. 164-168 5 p. |
artikel |
7 |
Effects of package and process variation on 2.4GHz analog integrated circuits
|
Szymañski, Andrzej |
|
2006 |
46 |
1 |
p. 189-193 5 p. |
artikel |
8 |
Effects of underfill materials on the reliability of low-K flip-chip packaging
|
Chen, K.M. |
|
2006 |
46 |
1 |
p. 155-163 9 p. |
artikel |
9 |
Electrical reliability aspects of HfO2 high-k gate dielectrics with TaN metal gate electrodes under constant voltage stress
|
Chatterjee, S. |
|
2006 |
46 |
1 |
p. 69-76 8 p. |
artikel |
10 |
Electronic device encapsulation using red phosphorus flame retardants
|
Pecht, Michael |
|
2006 |
46 |
1 |
p. 53-62 10 p. |
artikel |
11 |
Gate metal interdiffusion induced degradation in space-qualified GaAs PHEMTs
|
Chou, Y.C. |
|
2006 |
46 |
1 |
p. 24-40 17 p. |
artikel |
12 |
High-temperature reliability of Flip Chip assemblies
|
Braun, T. |
|
2006 |
46 |
1 |
p. 144-154 11 p. |
artikel |
13 |
Material properties and RF applications of high k and ferrite LTCC ceramics
|
Matters-Kammerer, M. |
|
2006 |
46 |
1 |
p. 134-143 10 p. |
artikel |
14 |
Measurements and simulations of transient characteristics of heat pipes
|
Legierski, Jarosław |
|
2006 |
46 |
1 |
p. 109-115 7 p. |
artikel |
15 |
NBTI degradation: From physical mechanisms to modelling
|
Huard, V. |
|
2006 |
46 |
1 |
p. 1-23 23 p. |
artikel |
16 |
[No title]
|
Stojcev, Mile |
|
2006 |
46 |
1 |
p. 196-197 2 p. |
artikel |
17 |
[No title]
|
Stojcev, Mile K. |
|
2006 |
46 |
1 |
p. 194-195 2 p. |
artikel |
18 |
[No title]
|
Stojcev, M. |
|
2006 |
46 |
1 |
p. 198-199 2 p. |
artikel |
19 |
PMOS NBTI-induced circuit mismatch in advanced technologies
|
Agostinelli, M. |
|
2006 |
46 |
1 |
p. 63-68 6 p. |
artikel |
20 |
Reliability of Pb(Mg,Nb)O3–Pb(Zr,Ti)O3 multilayer ceramic piezoelectric actuators by Weibull method
|
Koh, Jung-Hyuk |
|
2006 |
46 |
1 |
p. 183-188 6 p. |
artikel |
21 |
Temperature effects on DC and small signal RF performance of AlGaAs/GaAs HEMTs
|
Caddemi, A. |
|
2006 |
46 |
1 |
p. 169-173 5 p. |
artikel |
22 |
Thermal impedance plots of micro-scaled devices
|
Vermeersch, B. |
|
2006 |
46 |
1 |
p. 174-177 4 p. |
artikel |
23 |
Transient detection in COTS processors using software approach
|
Rajabzadeh, Amir |
|
2006 |
46 |
1 |
p. 124-133 10 p. |
artikel |
24 |
Transient IR imaging of light and flexible microelectronic devices
|
Radivojevic, Z. |
|
2006 |
46 |
1 |
p. 116-123 8 p. |
artikel |