nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comprehensive model for oxide degradation
|
Irrera, Fernanda |
|
2005 |
45 |
5-6 |
p. 853-856 4 p. |
artikel |
2 |
Admittance spectroscopy of traps at the interfaces of (100)Si with Al2O3, ZrO2, and HfO2
|
Truong, L. |
|
2005 |
45 |
5-6 |
p. 823-826 4 p. |
artikel |
3 |
AVD® technology for deposition of next generation devices
|
Weber, U. |
|
2005 |
45 |
5-6 |
p. 945-948 4 p. |
artikel |
4 |
Bond strain and defects at interfaces in high-k gate stacks
|
Lucovsky, G. |
|
2005 |
45 |
5-6 |
p. 770-778 9 p. |
artikel |
5 |
Breakdown spots of ultra-thin (EOT<1.5nm) HfO2/SiO2 stacks observed with enhanced—CAFM
|
Blasco, X. |
|
2005 |
45 |
5-6 |
p. 811-814 4 p. |
artikel |
6 |
Challenges for dielectric materials in future integrated circuit technologies
|
Garner, C.M. |
|
2005 |
45 |
5-6 |
p. 919-924 6 p. |
artikel |
7 |
Characterization of crystalline MOCVD SrTiO3 films on SiO2/Si(100)
|
Sibai, A. |
|
2005 |
45 |
5-6 |
p. 941-944 4 p. |
artikel |
8 |
Characterization of various insulators for possible use as low-k dielectrics deposited at temperatures below 200°C
|
Vasilopoulou, M. |
|
2005 |
45 |
5-6 |
p. 990-993 4 p. |
artikel |
9 |
Charge storage peculiarities in poly-Si–SiO2–Si memory devices with Si nanocrystals rich SiO2
|
Turchanikov, V.I. |
|
2005 |
45 |
5-6 |
p. 903-906 4 p. |
artikel |
10 |
Comparison of interfaces states density through their energy distribution and LVSILC induced by uniform and localized injections in 2.3nm thick oxides
|
Zander, D. |
|
2005 |
45 |
5-6 |
p. 891-894 4 p. |
artikel |
11 |
Comparison of metal gate electrodes on MOCVD HfO2
|
Lemme, M.C. |
|
2005 |
45 |
5-6 |
p. 953-956 4 p. |
artikel |
12 |
Conduction band states of transition metal (TM) high-k gate dielectrics as determined from X-ray absorption spectra
|
Lucovsky, G. |
|
2005 |
45 |
5-6 |
p. 827-830 4 p. |
artikel |
13 |
Crested barrier in the tunnel stack of non-volatile memories
|
Irrera, Fernanda |
|
2005 |
45 |
5-6 |
p. 907-910 4 p. |
artikel |
14 |
Dielectric properties of two phases of crystalline lutetium oxide
|
Delugas, Pietro |
|
2005 |
45 |
5-6 |
p. 831-833 3 p. |
artikel |
15 |
Dynamic Fowler–Nordheim injection in EEPROM tunnel oxides at realistic time scales
|
Baboux, N. |
|
2005 |
45 |
5-6 |
p. 911-914 4 p. |
artikel |
16 |
Electrical characterization of hafnium oxide and hafnium-rich silicate films grown by atomic layer deposition
|
Dueñas, S. |
|
2005 |
45 |
5-6 |
p. 949-952 4 p. |
artikel |
17 |
Electrical characterization of HfO2 films obtained by UV assisted injection MOCVD
|
Decams, J.M. |
|
2005 |
45 |
5-6 |
p. 929-932 4 p. |
artikel |
18 |
Electrical conduction mechanism in high-dielectric-constant ZrO2 thin films
|
Wang, Ming-Tsong |
|
2005 |
45 |
5-6 |
p. 969-972 4 p. |
artikel |
19 |
Electrical properties in low temperature range (5K–300K) of Tantalum Oxide dielectric MIM capacitors
|
Deloffre, E. |
|
2005 |
45 |
5-6 |
p. 925-928 4 p. |
artikel |
20 |
Electrical properties of hafnium silicate films obtained from a single-source MOCVD precursor
|
Lemberger, Martin |
|
2005 |
45 |
5-6 |
p. 819-822 4 p. |
artikel |
21 |
Electrical properties of metal–HfO2–silicon system measured from metal–insulator–semiconductor capacitors and metal–insulator–semiconductor field–effect transistors using HfO2 gate dielectric
|
Chiu, Fu-Chien |
|
2005 |
45 |
5-6 |
p. 961-964 4 p. |
artikel |
22 |
Electrical properties of MIS capacitor using low temperature electron beam gun—evaporated HfAlO dielectrics
|
Mikhelashvili, V. |
|
2005 |
45 |
5-6 |
p. 933-936 4 p. |
artikel |
23 |
Evidence and modelling current dependence of defect generation probability and its impact on charge to breakdown
|
Ribes, G. |
|
2005 |
45 |
5-6 |
p. 841-844 4 p. |
artikel |
24 |
Examination and evaluation of La2O3 as gate dielectric for sub-100nm CMOS and DRAM technology
|
Capodieci, V. |
|
2005 |
45 |
5-6 |
p. 937-940 4 p. |
artikel |
25 |
Experimental extraction of degradation parameters after constant voltage stress and substrate hot electron injection on ultrathin oxides
|
Trapes, C. |
|
2005 |
45 |
5-6 |
p. 883-886 4 p. |
artikel |
26 |
Experimental investigation of the dielectric-semiconductor interface with scanning capacitance microscopy
|
Yang, J. |
|
2005 |
45 |
5-6 |
p. 887-890 4 p. |
artikel |
27 |
Impact of interface and bulk trapped charges on transistor reliability
|
Ghidini, G. |
|
2005 |
45 |
5-6 |
p. 857-860 4 p. |
artikel |
28 |
Impact of nitrogen incorporation on interface states in (100)Si/HfO2
|
Fedorenko, Y.G. |
|
2005 |
45 |
5-6 |
p. 802-805 4 p. |
artikel |
29 |
Implementation of high-k and metal gate materials for the 45nm node and beyond: gate patterning development
|
Beckx, S. |
|
2005 |
45 |
5-6 |
p. 1007-1011 5 p. |
artikel |
30 |
Improved charge injection in Si nanocrystal non-volatile memories
|
Carreras, Josep |
|
2005 |
45 |
5-6 |
p. 899-902 4 p. |
artikel |
31 |
Improvement of the P/E window in nanocrystal memories by the use of high-k materials in the control dielectric
|
Spitale, E. |
|
2005 |
45 |
5-6 |
p. 895-898 4 p. |
artikel |
32 |
Influence of oxide breakdown position and device aspect ratio on MOSFET’s output characteristics
|
Fernández, R. |
|
2005 |
45 |
5-6 |
p. 861-864 4 p. |
artikel |
33 |
Influence of the annealing temperature on the IR properties of SiO2 films grown from SiH4 +O2
|
Vamvakas, V.Em. |
|
2005 |
45 |
5-6 |
p. 986-989 4 p. |
artikel |
34 |
In situ steam generation (ISSG) versus standard steam technology: impact on oxide reliability
|
Langenbuch, M. |
|
2005 |
45 |
5-6 |
p. 875-878 4 p. |
artikel |
35 |
Investigation into the correct statistical distribution for oxide breakdown over oxide thickness range
|
Prendergast, James |
|
2005 |
45 |
5-6 |
p. 973-977 5 p. |
artikel |
36 |
Junction leakage current degradation under high temperature reverse-bias stress induced by band-defect-band tunnelling in power VDMOS
|
Barletta, Giacomo |
|
2005 |
45 |
5-6 |
p. 994-999 6 p. |
artikel |
37 |
Light emission from Si/SiO2 superlattices fabricated by RPECVD
|
Rölver, R. |
|
2005 |
45 |
5-6 |
p. 915-918 4 p. |
artikel |
38 |
LPCVD-silicon oxynitride films: interface properties
|
Halova, E. |
|
2005 |
45 |
5-6 |
p. 982-985 4 p. |
artikel |
39 |
Modelling mobility degradation due to remote Coulomb scattering from dielectric charges and its impact on MOS device performance
|
Lujan, G.S. |
|
2005 |
45 |
5-6 |
p. 794-797 4 p. |
artikel |
40 |
[No title]
|
Stojcev, Mile |
|
2005 |
45 |
5-6 |
p. 1017-1018 2 p. |
artikel |
41 |
[No title]
|
Stojcev, Mile |
|
2005 |
45 |
5-6 |
p. 1019-1020 2 p. |
artikel |
42 |
[No title]
|
Hurley, Paul |
|
2005 |
45 |
5-6 |
p. 767-769 3 p. |
artikel |
43 |
[No title]
|
Stojcev, Mile |
|
2005 |
45 |
5-6 |
p. 1012-1013 2 p. |
artikel |
44 |
[No title]
|
Stojcev, Mile |
|
2005 |
45 |
5-6 |
p. 1014-1016 3 p. |
artikel |
45 |
Observation and characterization of defects in HfO2 high-K gate dielectric layers
|
Kaushik, Vidya |
|
2005 |
45 |
5-6 |
p. 798-801 4 p. |
artikel |
46 |
On the data interpretation of the C-AFM measurements in the characterization of thin insulating layers
|
Pétry, J. |
|
2005 |
45 |
5-6 |
p. 815-818 4 p. |
artikel |
47 |
On the influence of substrate cleaning method and rapid thermal annealing conditions on the electrical characteristics of Al/SiN x /SiO2/Si fabricated by ECR-CVD
|
Dueñas, S. |
|
2005 |
45 |
5-6 |
p. 978-981 4 p. |
artikel |
48 |
On the SILC mechanism in MOSFET’s with ultrathin oxides
|
Bauza, D. |
|
2005 |
45 |
5-6 |
p. 849-852 4 p. |
artikel |
49 |
Optical and electrical characterization of hafnium oxide deposited by MOCVD
|
Lu, Y. |
|
2005 |
45 |
5-6 |
p. 965-968 4 p. |
artikel |
50 |
Optimization of low temperature silicon nitride processes for improvement of device performance
|
Sleeckx, E. |
|
2005 |
45 |
5-6 |
p. 865-868 4 p. |
artikel |
51 |
Performance improvement of self-aligned HfO2/TaN and SiON/TaN nMOS transistors
|
Schram, T. |
|
2005 |
45 |
5-6 |
p. 779-782 4 p. |
artikel |
52 |
Post deposition UV-induced O2 annealing of HfO2 thin films
|
Fang, Q. |
|
2005 |
45 |
5-6 |
p. 957-960 4 p. |
artikel |
53 |
Potential remedies for the V T/V fb-shift problem of Hf/polysilicon-based gate stacks: a solution-based survey
|
Deweerd, W. |
|
2005 |
45 |
5-6 |
p. 786-789 4 p. |
artikel |
54 |
Probing stress effects in HfO2 gate stacks with time dependent measurements
|
Young, Chadwin D. |
|
2005 |
45 |
5-6 |
p. 806-810 5 p. |
artikel |
55 |
Process integration and nanometer-scale electrical characterization of crystalline high-k gate dielectrics
|
Schwalke, Udo |
|
2005 |
45 |
5-6 |
p. 790-793 4 p. |
artikel |
56 |
Progressive breakdown in ultrathin SiON dielectrics and its effect on transistor performance
|
O’Connor, Robert |
|
2005 |
45 |
5-6 |
p. 869-874 6 p. |
artikel |
57 |
Reliability of gate dielectrics and metal–insulator–metal capacitors
|
Martin, Andreas |
|
2005 |
45 |
5-6 |
p. 834-840 7 p. |
artikel |
58 |
Reverse short channel effects in high-k gated nMOSFETs
|
Han, J.-P. |
|
2005 |
45 |
5-6 |
p. 783-785 3 p. |
artikel |
59 |
Silicon dioxide deposited by ECR-PECVD for low-temperature Si devices processing
|
Pecora, A. |
|
2005 |
45 |
5-6 |
p. 879-882 4 p. |
artikel |
60 |
Structure of the oxide damage under progressive breakdown
|
Palumbo, F. |
|
2005 |
45 |
5-6 |
p. 845-848 4 p. |
artikel |
61 |
The effect of electrode material on the electrical conduction of metal-Pb(Zr0.53Ti0.47)O3-metal thin film capacitors
|
Juan, P.C. |
|
2005 |
45 |
5-6 |
p. 1003-1006 4 p. |
artikel |
62 |
Vapour pressure measurement of low volatility precursors
|
Rushworth, S.A. |
|
2005 |
45 |
5-6 |
p. 1000-1002 3 p. |
artikel |