| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accurate natural convection modelling for magnetic components
|
Valchev, Vencislav
|
|
2003
|
43 |
5 |
p. 795-802
8 p.
|
artikel
|
| 2 |
Calendar of forthcoming events
|
|
|
2003
|
43 |
5 |
p. I-IX
nvt p.
|
artikel
|
| 3 |
Development of the green plastic encapsulation for high density wirebonded leaded packages
|
Lin, T.Y.
|
|
2003
|
43 |
5 |
p. 811-817
7 p.
|
artikel
|
| 4 |
Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide
|
Lee, Chihoon
|
|
2003
|
43 |
5 |
p. 735-739
5 p.
|
artikel
|
| 5 |
Field failure due to creep corrosion on components with palladium pre-plated leadframes
|
Zhao, Ping
|
|
2003
|
43 |
5 |
p. 775-783
9 p.
|
artikel
|
| 6 |
High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp. 247, plus XIII, €142, ISBN 1-4020-7255-4
|
Stojcev, Mile
|
|
2003
|
43 |
5 |
p. 819-
1 p.
|
artikel
|
| 7 |
Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET’s (n-DTMOSFET) measured by gated-diode configuration
|
Huang, Ru
|
|
2003
|
43 |
5 |
p. 707-711
5 p.
|
artikel
|
| 8 |
Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation
|
Tseng, Summer F.C.
|
|
2003
|
43 |
5 |
p. 713-724
12 p.
|
artikel
|
| 9 |
Integrating testability with design space exploration
|
Zwolinski, M.
|
|
2003
|
43 |
5 |
p. 685-693
9 p.
|
artikel
|
| 10 |
Isothermal aging characteristics of Sn–Pb micro solder bumps
|
Kim, K.S.
|
|
2003
|
43 |
5 |
p. 757-763
7 p.
|
artikel
|
| 11 |
Optimization of on-chip ESD protection structures for minimal parasitic capacitance
|
Gao, Xiaofang
|
|
2003
|
43 |
5 |
p. 725-733
9 p.
|
artikel
|
| 12 |
Prediction and verification of process induced warpage of electronic packages
|
van Driel, W.D.
|
|
2003
|
43 |
5 |
p. 765-774
10 p.
|
artikel
|
| 13 |
Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA
|
Ghaffarian, Reza
|
|
2003
|
43 |
5 |
p. 695-706
12 p.
|
artikel
|
| 14 |
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill
|
Tee, Tong Yan
|
|
2003
|
43 |
5 |
p. 741-749
9 p.
|
artikel
|
| 15 |
Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method
|
Wang, Qian
|
|
2003
|
43 |
5 |
p. 751-756
6 p.
|
artikel
|
| 16 |
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages
|
Lin, T.Y.
|
|
2003
|
43 |
5 |
p. 803-809
7 p.
|
artikel
|
| 17 |
Thermal design of a broadband communication system with detailed modeling of TBGA packages
|
Zhao, Z.
|
|
2003
|
43 |
5 |
p. 785-793
9 p.
|
artikel
|
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