| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions
|
Yang, Pei
|
|
|
166 |
C |
p.
|
artikel
|
| 2 |
Conductance variability in RRAM and its implications at the neural network level
|
Aziza, H.
|
|
|
166 |
C |
p.
|
artikel
|
| 3 |
Editorial Board
|
|
|
|
166 |
C |
p.
|
artikel
|
| 4 |
Effects of solder solidification temperature on residual stress distribution and failure location in BGA solder joints
|
Razzaq, Mohammed Abdel
|
|
|
166 |
C |
p.
|
artikel
|
| 5 |
Gate sizing and buffer insertion for circuit aging and thermal resilience enhancement
|
Xiong, Ling
|
|
|
166 |
C |
p.
|
artikel
|
| 6 |
Improved short circuit performance of silicon carbide VD-MOSFETs using a P+ implant
|
Singh, Prashant
|
|
|
166 |
C |
p.
|
artikel
|
| 7 |
Increased high-temperature stiffness of an epoxy-based molding compound through high-temperature storage
|
Ukita, Masaya
|
|
|
166 |
C |
p.
|
artikel
|
| 8 |
Influence of top-side metal layers on the performance of gold, silver, and copper wire bonds on aluminum pads
|
Yen, Hao-Lin
|
|
|
166 |
C |
p.
|
artikel
|
| 9 |
Investigation of electromagnetic force effect in IGBT modules
|
Wang, Jiahao
|
|
|
166 |
C |
p.
|
artikel
|
| 10 |
Investigation of ESD protection devices for SiC-based monolithic integrated circuits
|
Ke, Chao-Yang
|
|
|
166 |
C |
p.
|
artikel
|
| 11 |
Investigation on FCBGA package with vertical-aligned carbon fiber thermal pad as thermal interface material
|
Yi, Mingming
|
|
|
166 |
C |
p.
|
artikel
|
| 12 |
Microstructure and mechanical evolution of sintered silver on Ni/Pd/Au and Ni/Au finished substrates
|
Zhang, Yuchen
|
|
|
166 |
C |
p.
|
artikel
|
| 13 |
Reliability analysis of the intricacies of interfacial trap charges in HD-VS-FeFinFET and its applicability as CMOS inverter
|
Verma, Kajal
|
|
|
166 |
C |
p.
|
artikel
|
| 14 |
Simulation-based FMEA for the reliability assessment of printed circuit boards
|
Schmidt, Hendrik
|
|
|
166 |
C |
p.
|
artikel
|
| 15 |
Simulation of intergranular crack extension at Cu/Al wire bonding interface
|
Yao, Jingguang
|
|
|
166 |
C |
p.
|
artikel
|
| 16 |
The research on the infrared time-sequence imaging inspection method for internal defects of 3D TSV packaging
|
Lei, Nie
|
|
|
166 |
C |
p.
|
artikel
|
Tijdschrift beschrijving