| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A machine learning and finite element simulation-based void inspection for higher solder joint reliability
|
Chen, Kaiyuan
|
|
|
154 |
C |
p.
|
artikel
|
| 2 |
Behavioral electrothermal modeling of MOSFET for energy conversion circuits simulation using MATLAB/Simulink
|
Baghdadi, Mohamed
|
|
|
154 |
C |
p.
|
artikel
|
| 3 |
Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect
|
Wan, Guoshun
|
|
|
154 |
C |
p.
|
artikel
|
| 4 |
Editorial Board
|
|
|
|
154 |
C |
p.
|
artikel
|
| 5 |
Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing
|
Felke, Florens
|
|
|
154 |
C |
p.
|
artikel
|
| 6 |
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics
|
Wang, Dandan
|
|
|
154 |
C |
p.
|
artikel
|
| 7 |
Evaluation on the electro-thermal instability process of thermal runaway under high temperature based on TCAD
|
Ma, Xiao
|
|
|
154 |
C |
p.
|
artikel
|
| 8 |
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds
|
Gharaibeh, Mohammad A.
|
|
|
154 |
C |
p.
|
artikel
|
| 9 |
Grain boundaries-dominated migration failure of copper interconnect under multiphysics field: Insight from theoretical modeling and finite element analysis
|
Zhu, Yixue
|
|
|
154 |
C |
p.
|
artikel
|
| 10 |
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices
|
Liu, Zhenhua
|
|
|
154 |
C |
p.
|
artikel
|
| 11 |
Implementation of high failure current Schottky-embedded DDSCR
|
Liu, Wei
|
|
|
154 |
C |
p.
|
artikel
|
| 12 |
Methods of coping with fractured FPGA leads during space qualification
|
Özyildirim, Alime
|
|
|
154 |
C |
p.
|
artikel
|
| 13 |
New translation method to STC of photovoltaic module characteristics: A comparison of conventional approaches and proposal of a novel method
|
Hali, Aissa
|
|
|
154 |
C |
p.
|
artikel
|
| 14 |
Single-event burnout resilient design of 4H-SiC MOSFETs through staircase-like buffer layer
|
Wang, Haibin
|
|
|
154 |
C |
p.
|
artikel
|
| 15 |
Solder joint shape optimization and thermal-mechanical reliability improvement for microwave RF coaxial connectors
|
Li, Geng
|
|
|
154 |
C |
p.
|
artikel
|
| 16 |
Triple-node-upset self-recoverable latch design for aerospace applications
|
Bai, Yuxin
|
|
|
154 |
C |
p.
|
artikel
|
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