| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comprehensive analysis of LDMOS transistors for analog applications under γ-radiation
|
Routh, Sujay
|
|
|
148 |
C |
p.
|
artikel
|
| 2 |
Active junction temperature control of IGBTs for electric vehicle drive system based on hybrid control strategy
|
Lai, Wei
|
|
|
148 |
C |
p.
|
artikel
|
| 3 |
Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading
|
Heyn, W.
|
|
|
148 |
C |
p.
|
artikel
|
| 4 |
Bonding wire characterization using non-destructive X-ray imaging
|
Muß, D.
|
|
|
148 |
C |
p.
|
artikel
|
| 5 |
Concurrent characterization of GaN MOSHEMT gate leakage via electrical and thermoreflectance measurements
|
Kortge, David
|
|
|
148 |
C |
p.
|
artikel
|
| 6 |
Contact reliability design modeling for wire spring-hole electrical connectors
|
Ping, Qian
|
|
|
148 |
C |
p.
|
artikel
|
| 7 |
Die level predictive modeling to reduce latent reliability defect escapes
|
Lenhard, Petr
|
|
|
148 |
C |
p.
|
artikel
|
| 8 |
Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test
|
Akoda, K.E.
|
|
|
148 |
C |
p.
|
artikel
|
| 9 |
Editorial Board
|
|
|
|
148 |
C |
p.
|
artikel
|
| 10 |
Electrical instabilities of a-IGZO TFTs under different conditions of bias and illumination stress
|
Toledo, Pablo
|
|
|
148 |
C |
p.
|
artikel
|
| 11 |
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions
|
Oliveira, J.
|
|
|
148 |
C |
p.
|
artikel
|
| 12 |
Influence of deep level trap charges on the reliability of asymmetric doped double gate JunctionLess transistor (AD-DG-JLT)
|
Kumari, Vandana
|
|
|
148 |
C |
p.
|
artikel
|
| 13 |
Multi-scale in-situ micro-mechanical characterization of Polymer Core Solder Ball (PCSB) coatings for BGA interconnections
|
Malkorra, I.
|
|
|
148 |
C |
p.
|
artikel
|
| 14 |
NSFET performance optimization through SiGe channel design - A simulation study
|
Cheng, Shan-Lin
|
|
|
148 |
C |
p.
|
artikel
|
| 15 |
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach
|
Brito, E.M.S.
|
|
|
148 |
C |
p.
|
artikel
|
| 16 |
Optimizing the performance of the ZnO-based varistors using the neural networks technique
|
Alhaj Omar, Fuad
|
|
|
148 |
C |
p.
|
artikel
|
| 17 |
Physical insights into the reliability of sunken source connected field plate GaN HEMTs for mm-wave applications
|
Chanchal,
|
|
|
148 |
C |
p.
|
artikel
|
| 18 |
Software-controlled pipeline parity in GPU architectures for error detection
|
Braga, Giani
|
|
|
148 |
C |
p.
|
artikel
|
| 19 |
Study on the properties of epoxy-based Sn58Bi solder joints
|
Li, Xiao-guang
|
|
|
148 |
C |
p.
|
artikel
|
| 20 |
Synthesis and photoluminescence properties of Ce3+ and Tb3+ doped Na3Gd(PO4)2 phosphors for white LEDs
|
Xie, Meiling
|
|
|
148 |
C |
p.
|
artikel
|
| 21 |
The characterization of low-k thin films and their fracture analysis in a WLCSP device
|
Wang, Lei
|
|
|
148 |
C |
p.
|
artikel
|
| 22 |
The optimal capacity ratio and power limit setting method of the PV generation system based on the IGBT reliability and PV economy
|
Zhang, Bo
|
|
|
148 |
C |
p.
|
artikel
|
| 23 |
The TETRISC SoC—A resilient quad-core system based on the ResiliCell approach
|
Ulbricht, Markus
|
|
|
148 |
C |
p.
|
artikel
|
| 24 |
TIMs for transfer molded power modules: Characterization, reliability, and modeling
|
Sitta, Alessandro
|
|
|
148 |
C |
p.
|
artikel
|
| 25 |
TLP/VFTLP investigation on eNVM 1T1R PCM in FD-SOI UTBB CMOS technology at room temperature
|
Galy, Ph.
|
|
|
148 |
C |
p.
|
artikel
|
| 26 |
Unsupervised graph-based image clustering for pretext distribution learning in IC assurance
|
Tee, Yee-Yang
|
|
|
148 |
C |
p.
|
artikel
|
| 27 |
Vulcanization failure mechanism analysis of lead-frame LED package
|
Li, Yinle
|
|
|
148 |
C |
p.
|
artikel
|
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