| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
BP neural network for non-invasive IGBT junction temperature online detection
|
Liu, Li
|
|
|
141 |
C |
p.
|
artikel
|
| 2 |
Editorial Board
|
|
|
|
141 |
C |
p.
|
artikel
|
| 3 |
Effect of temperature cycling on the leakage mechanism of TSV liner
|
Chen, Si
|
|
|
141 |
C |
p.
|
artikel
|
| 4 |
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation
|
Xiang, Meiju
|
|
|
141 |
C |
p.
|
artikel
|
| 5 |
High-performance and highly-stable soft error resistant 12T SRAM cell for space applications
|
Liu, Zhongyang
|
|
|
141 |
C |
p.
|
artikel
|
| 6 |
High-performance and space-qualified hybrid integrated circuit based on multi-group homogeneous gradient eutectic in quality conformance inspection
|
Yu, Dingzhan
|
|
|
141 |
C |
p.
|
artikel
|
| 7 |
Investigation on fatigue mechanism of solder layers in IGBT modules under high temperature gradients
|
Zhao, Shihan
|
|
|
141 |
C |
p.
|
artikel
|
| 8 |
Simulation analysis of electromagnetic pulse susceptibility and hardening design for system-in-package SZ0501
|
Li, Ning
|
|
|
141 |
C |
p.
|
artikel
|
| 9 |
Sintering of mixed CuAg nanoparticles pretreated by formic acid vapor for CuCu low temperature bonding
|
Yang, Wenhua
|
|
|
141 |
C |
p.
|
artikel
|
| 10 |
Small sample classification based on data enhancement and its application in flip chip defection
|
Sha, Yuhua
|
|
|
141 |
C |
p.
|
artikel
|
| 11 |
Study on the interface mechanism of copper migration failure in solder mask-substrate package
|
Li, Yesu
|
|
|
141 |
C |
p.
|
artikel
|
| 12 |
Thermal stress and drop stress analysis based on 3D package reliability study
|
Xue, Leyang
|
|
|
141 |
C |
p.
|
artikel
|
| 13 |
Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
|
Tavakolibasti, M.
|
|
|
141 |
C |
p.
|
artikel
|
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