| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fast Binary Decision Diagram (BDD)-based reversible logic optimization engine driven by recent meta-heuristic reordering algorithms
|
Abdalhaq, Baker
|
|
|
123 |
C |
p.
|
artikel
|
| 2 |
A humidity-induced novel failure mechanism in power semiconductor diodes
|
Leppänen, J.
|
|
|
123 |
C |
p.
|
artikel
|
| 3 |
A low cost fault-attack resilient AES for IoT applications
|
Sheikhpour, Saeideh
|
|
|
123 |
C |
p.
|
artikel
|
| 4 |
Area-efficient dual-diode with optimized parasitic bipolar structure for rail-based ESD protections
|
Wang, Hui
|
|
|
123 |
C |
p.
|
artikel
|
| 5 |
A self-adaptive DBSCAN-based method for wafer bin map defect pattern classification
|
Chen, Shouhong
|
|
|
123 |
C |
p.
|
artikel
|
| 6 |
Characterization of plastic and creep behavior in thick aluminum wire for power modules
|
Shishido, Nobuyuki
|
|
|
123 |
C |
p.
|
artikel
|
| 7 |
Constituents and performance of no-clean flux for electronic solder
|
Wakeel, Saif
|
|
|
123 |
C |
p.
|
artikel
|
| 8 |
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach
|
Sao, Yogendra
|
|
|
123 |
C |
p.
|
artikel
|
| 9 |
Deep learning-based image analysis framework for hardware assurance of digital integrated circuits
|
Lin, Tong
|
|
|
123 |
C |
p.
|
artikel
|
| 10 |
DLBF: A low overhead wear leveling algorithm for embedded systems with hybrid memory
|
Niu, Na
|
|
|
123 |
C |
p.
|
artikel
|
| 11 |
Editorial Board
|
|
|
|
123 |
C |
p.
|
artikel
|
| 12 |
Effect of high- and low-side blocking on short-circuit characteristics of SiC MOSFET
|
Bai, Kun
|
|
|
123 |
C |
p.
|
artikel
|
| 13 |
Electrical and cyclic bending properties of screen-printed conductive patterns containing different ratios of silver microparticles and silver microflakes
|
Maeda, Kazuki
|
|
|
123 |
C |
p.
|
artikel
|
| 14 |
Equivalent circuits for electromigration
|
Najm, Farid N.
|
|
|
123 |
C |
p.
|
artikel
|
| 15 |
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
|
Malik, Muhammad Hassan
|
|
|
123 |
C |
p.
|
artikel
|
| 16 |
Influence of ionisation track structure on 20 nm FDSOI transistor
|
Zhang, Hao
|
|
|
123 |
C |
p.
|
artikel
|
| 17 |
In-situ diagnosis of solder joint failure by means of thermal resistance measurement
|
Li, Zidi
|
|
|
123 |
C |
p.
|
artikel
|
| 18 |
Lifetime improvement of digital microfluidic biochips based on the IWOA
|
Shi, Jinlong
|
|
|
123 |
C |
p.
|
artikel
|
| 19 |
Linear dependence of post-irradiation input bias currents on pre-irradiation values in silicon bipolar microcircuits
|
Song, Yu
|
|
|
123 |
C |
p.
|
artikel
|
| 20 |
Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison
|
Meszmer, Peter
|
|
|
123 |
C |
p.
|
artikel
|
| 21 |
Recent review on failures in silicon carbide power MOSFETs
|
Ngwashi, Divine Khan
|
|
|
123 |
C |
p.
|
artikel
|
| 22 |
SEE evaluation of ARM M0 cores in a 28 nm FDSOI technology
|
Shi, S.-T.
|
|
|
123 |
C |
p.
|
artikel
|
| 23 |
Short term reliability and robustness of ultra-thin barrier, 110 nm-gate AlN/GaN HEMTs
|
Gao, ZHan
|
|
|
123 |
C |
p.
|
artikel
|
| 24 |
SSFA: Subset fault analysis of ASCON-128 authenticated cipher
|
Joshi, Priyanka
|
|
|
123 |
C |
p.
|
artikel
|
| 25 |
Study on atomic migration of copper through-silicon-vias with Bosch scallops
|
Cheng, Zhiqiang
|
|
|
123 |
C |
p.
|
artikel
|
| 26 |
Synthesis of self-adaptable energy aware software for heterogeneous multicore embedded systems
|
Deniziak, Stanisław
|
|
|
123 |
C |
p.
|
artikel
|
| 27 |
Testing of in-memory-computing memories with 8 T SRAMs
|
Tsai, Tsai-Ling
|
|
|
123 |
C |
p.
|
artikel
|
| 28 |
Theoretical examination of thermo-migration in novel platinum microheaters
|
Filipovic, Lado
|
|
|
123 |
C |
p.
|
artikel
|
| 29 |
Three-dimensional moisture diffusion simulation with time dependent saturated concentration in ANSYS through native thermal and spring elements
|
Anicode, S.V.K.
|
|
|
123 |
C |
p.
|
artikel
|
| 30 |
Time-dependent dielectric breakdown of gate oxide on 4H-SiC with different oxidation processes
|
Tsui, Bing-Yue
|
|
|
123 |
C |
p.
|
artikel
|
| 31 |
Transformation of reflow solder flux residue under humid conditions
|
Piotrowska, Kamila
|
|
|
123 |
C |
p.
|
artikel
|
| 32 |
1200V 4H-SiC trench MOSFET with superior figure of merit and suppressed quasi-saturation effect
|
Fu, Hao
|
|
|
123 |
C |
p.
|
artikel
|
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