| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET
|
Pandey, Chandan K.
|
|
|
122 |
C |
p.
|
artikel
|
| 2 |
CNN weight sharing based on a fast accuracy estimation metric
|
Dupuis, Etienne
|
|
|
122 |
C |
p.
|
artikel
|
| 3 |
Degraded power MOSFET effects on Class-A power amplifier: Modelling studies considering feedback
|
Meydanci, Mehmet Akif
|
|
|
122 |
C |
p.
|
artikel
|
| 4 |
Design of analog nonlinear transformations based on a Gilbert multiplier for energy detection
|
Vauche, R.
|
|
|
122 |
C |
p.
|
artikel
|
| 5 |
Editorial Board
|
|
|
|
122 |
C |
p.
|
artikel
|
| 6 |
Effect of high current pulses on solder interfacial reaction and interconnect reliability
|
Mei, J.
|
|
|
122 |
C |
p.
|
artikel
|
| 7 |
Effect of intrinsic PCB parameters on the performance of fluoropolymer coating under condensing humidity conditions
|
Mantis, Ioannis
|
|
|
122 |
C |
p.
|
artikel
|
| 8 |
Effect of thermo-mechanical ageing on materials and interface properties in flexible microelectronic devices
|
Chapel, Anthony
|
|
|
122 |
C |
p.
|
artikel
|
| 9 |
High-level fault injection to assess FMEA on critical systems
|
Roux, Julie
|
|
|
122 |
C |
p.
|
artikel
|
| 10 |
Influence of power cycling ageing on the current and voltage transitions during hard switching of IGBT devices
|
Deng, Erping
|
|
|
122 |
C |
p.
|
artikel
|
| 11 |
Investigation of the passivation-induced VTH shift in p-GaN HEMTs with Au-free gate-first process
|
Tang, Shun-Wei
|
|
|
122 |
C |
p.
|
artikel
|
| 12 |
Investigations of short-circuit failure in double trench SiC MOSFETs through three-dimensional electro-thermal-mechanical stress analysis
|
Yao, Kailun
|
|
|
122 |
C |
p.
|
artikel
|
| 13 |
Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence
|
Jiang, Nan
|
|
|
122 |
C |
p.
|
artikel
|
| 14 |
The aging analysis method of IGBT with composite failure mode based on Miner linear fatigue cumulative theory
|
Li, Lie
|
|
|
122 |
C |
p.
|
artikel
|
| 15 |
The effect of low temperature conditions on vibration durability of SAC105 interconnects
|
Meier, Karsten
|
|
|
122 |
C |
p.
|
artikel
|
| 16 |
The impact of parasitic inductance on the dV/dt ruggedness of 4H-SiC Schottky diodes
|
Ivanov, Pavel A.
|
|
|
122 |
C |
p.
|
artikel
|
| 17 |
The impact of self-heating and its implications on hot-carrier degradation – A modeling study
|
Tyaginov, S.
|
|
|
122 |
C |
p.
|
artikel
|
| 18 |
Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics
|
Mazullah,
|
|
|
122 |
C |
p.
|
artikel
|
| 19 |
Towards virtual twin for electronic packages in automotive applications
|
Prisacaru, Alexandru
|
|
|
122 |
C |
p.
|
artikel
|
| 20 |
Wafer defect pattern classification with detecting out-of-distribution
|
Kim, Yusung
|
|
|
122 |
C |
p.
|
artikel
|
Tijdschrift beschrijving