| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow
|
Wang, Jing
|
|
|
112 |
C |
p.
|
article
|
| 2 |
An ion beam layer removal method of determining the residual stress in the as-fabricated TSV-Cu/TiW/SiO2/Si interface on a nanoscale
|
Chen, S.
|
|
|
112 |
C |
p.
|
article
|
| 3 |
Editorial Board
|
|
|
|
112 |
C |
p.
|
article
|
| 4 |
Effect of TID electronradiation on SiGe BiCMOS LNAs at V-band
|
Sagouo Minko, Flavien
|
|
|
112 |
C |
p.
|
article
|
| 5 |
Efficiency droop in green InGaN/GaN light emitting diodes: Degradation mechanisms and initial characteristics
|
Herzog, Alexander
|
|
|
112 |
C |
p.
|
article
|
| 6 |
Electrical characterization of SiC MOS capacitors: A critical review
|
Pande, Peyush
|
|
|
112 |
C |
p.
|
article
|
| 7 |
Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects
|
Vanstreels, Kris
|
|
|
112 |
C |
p.
|
article
|
| 8 |
Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test
|
Jeong, Haksan
|
|
|
112 |
C |
p.
|
article
|
| 9 |
MEMS capacitive microphone with various materials in acoustic plate under shock loading
|
Lu, Chun-Lin
|
|
|
112 |
C |
p.
|
article
|
| 10 |
On-line self-test mechanism for Dual-Core Lockstep System-on-Chips
|
Floridia, Andrea
|
|
|
112 |
C |
p.
|
article
|
| 11 |
Reliability analysis of multilayer polymer aluminum electrolytic capacitors
|
Romero, Jose
|
|
|
112 |
C |
p.
|
article
|
| 12 |
Thermal optimized discontinuous modulation strategy for three phase impedance source inverter
|
Liu, Ping
|
|
|
112 |
C |
p.
|
article
|
Journal description