| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Analyzing the impact of soft errors in VGG networks implemented on GPUs
|
Wei, Jinghe
|
|
|
110 |
C |
p.
|
article
|
| 2 |
Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper
|
Zhang, Xingkai
|
|
|
110 |
C |
p.
|
article
|
| 3 |
CSTBT™ technology for high voltage applications with high dynamic robustness and low overall loss
|
Nakamura, Katsumi
|
|
|
110 |
C |
p.
|
article
|
| 4 |
Defect inspection of flip chip solder joints based on non-destructive methods: A review
|
Su, Lei
|
|
|
110 |
C |
p.
|
article
|
| 5 |
Editorial Board
|
|
|
|
110 |
C |
p.
|
article
|
| 6 |
Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking
|
Xu, Hongbo
|
|
|
110 |
C |
p.
|
article
|
| 7 |
Fault diagnosis and prognosis based on physical knowledge and reliability data: Application to MOS Field-Effect Transistor
|
Djeziri, M.A.
|
|
|
110 |
C |
p.
|
article
|
| 8 |
High-energy proton irradiation effects on GaN hybrid-drain-embedded gate injection transistors
|
Floriduz, Alessandro
|
|
|
110 |
C |
p.
|
article
|
| 9 |
In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor
|
Yang, Yu-Hsiang
|
|
|
110 |
C |
p.
|
article
|
| 10 |
Mechanical integrity of back-end-of-line with Ru nanowires and airgaps
|
Zahedmanesh, Houman
|
|
|
110 |
C |
p.
|
article
|
| 11 |
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions
|
Dele-Afolabi, T.T.
|
|
|
110 |
C |
p.
|
article
|
| 12 |
Minimum voltage control for reliability improvement in modular multilevel cascade converters-based STATCOM
|
de Sousa, R.O.
|
|
|
110 |
C |
p.
|
article
|
| 13 |
Modeling and analysis of mesh pattern influences on DBC thermal cycling reliability
|
Han, Lubin
|
|
|
110 |
C |
p.
|
article
|
| 14 |
Modelling and analysis of vibration on power electronic module structure and application of model order reduction
|
Rajaguru, Pushpa
|
|
|
110 |
C |
p.
|
article
|
| 15 |
Monitoring of defects creation sequence in 808 nm laser diode by reflectance analysis
|
Hao, Tieying
|
|
|
110 |
C |
p.
|
article
|
| 16 |
Performance of SiC cascode JFETs under single and repetitive avalanche pulses
|
Agbo, S.N.
|
|
|
110 |
C |
p.
|
article
|
| 17 |
Printed wire assembly HASS profile development based on HALT
|
Awad, Mahmoud I.
|
|
|
110 |
C |
p.
|
article
|
| 18 |
Pursuing computationally efficient wear-out prediction of PV inverters: The role of the mission profile resolution
|
Silva, R.P.
|
|
|
110 |
C |
p.
|
article
|
| 19 |
Recovery investigation of NBTI-induced traps in n-MOSFET devices
|
Djezzar, Boualem
|
|
|
110 |
C |
p.
|
article
|
| 20 |
Relative effectiveness of high-k passivation and gate-connected field plate techniques in enhancing GaN HEMT breakdown
|
Prasannanjaneyulu, Bhavana
|
|
|
110 |
C |
p.
|
article
|
| 21 |
Research of single-event burnout and hardened GaN MISFET with embedded PN junction
|
Fei, Xin-Xing
|
|
|
110 |
C |
p.
|
article
|
| 22 |
Single Event Upsets characterization of 65 nm CMOS 6T and 8T SRAM cells for ground level environment
|
Malagón, Daniel
|
|
|
110 |
C |
p.
|
article
|
| 23 |
Stable and reliable ohmic contact on p-type 4H-SiC up to 1500 h of aging at 600 °C
|
Abou Hamad, Valdemar
|
|
|
110 |
C |
p.
|
article
|
| 24 |
Three-phase SiC inverter with active limitation of all MOSFETs junction temperature
|
Stella, Fausto
|
|
|
110 |
C |
p.
|
article
|
Journal description