| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Al Diffusion in Polycrystalline Cu
|
Gstrein, Florian
|
|
|
1079 |
1 |
|
artikel
|
| 2 |
Changes of UV Optical Properties of Plasma Damaged Low-k Dielectrics for Sidewall Damage Scatterometry
|
Marsik, Premysl
|
|
|
1079 |
1 |
|
artikel
|
| 3 |
Cobalt Silicidation on Sub 100nm Hole Patterned Vertical Diode Formed by Silicon Epitaxial Growth and Its Electrical Properties
|
Min, Yong Lee
|
|
|
1079 |
1 |
|
artikel
|
| 4 |
Copper CMP with Composite Polymer Core - Silica Shell Abrasives: A Defectivity Study
|
Armini, Silvia
|
|
|
1079 |
1 |
|
artikel
|
| 5 |
Dependence of thermal stability of NiSi and Ni(Pt)Si /Si on crystal orientation
|
Okubo, Kazuya
|
|
|
1079 |
1 |
|
artikel
|
| 6 |
Dielectric Recovery of Plasma Damaged Organosilicate Low-k Films
|
Shi, Hualiang
|
|
|
1079 |
1 |
|
artikel
|
| 7 |
Effects of Plasma Surface Treatment on the Self-forming Barrier Process in Porous SiOCH
|
Chung, Seung-Min
|
|
|
1079 |
1 |
|
artikel
|
| 8 |
Effects of Pulse Duration and Polarity on the Electromigration Behavior of Copper Interconnects under Pulsed Current Stress
|
Meng, Keong Lim
|
|
|
1079 |
1 |
|
artikel
|
| 9 |
Electromigration of Cu Interconnect Lines Prepared by a Plasma-based Etch Process
|
Liu, Guojun
|
|
|
1079 |
1 |
|
artikel
|
| 10 |
Extendibility Study of a PVD Cu Seed Process with Ar+ Rf-Plasma Enhanced Coverage for 45nm Interconnects
|
Andrew, H. Simon
|
|
|
1079 |
1 |
|
artikel
|
| 11 |
Formation of Mn Oxide with Thermal CVD and its Diffusion Barrier Property Between Cu and SiO2
|
Neishi, Koji
|
|
|
1079 |
1 |
|
artikel
|
| 12 |
From Process Assumptions to Development to Manufacturing
|
Standaert, Theo
|
|
|
1079 |
1 |
|
artikel
|
| 13 |
Growth and Integration of High-Density CNT for BEOL Interconnects
|
Ainhoa, Romo Negreira
|
|
|
1079 |
1 |
|
artikel
|
| 14 |
In-situ early stage electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction
|
Chen, Kai
|
|
|
1079 |
1 |
|
artikel
|
| 15 |
Mechanical Integrity Study of Air Gap Structures Assisted by FE Simulations
|
Moreau, Stephane
|
|
|
1079 |
1 |
|
artikel
|
| 16 |
Modelling and Characterization of Ultrasonic Consolidation Process of Aluminium Alloys
|
Amir, Mohammed Siddiq
|
|
|
1079 |
1 |
|
artikel
|
| 17 |
Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics
|
Vinogradova, Ekaterina
|
|
|
1079 |
1 |
|
artikel
|
| 18 |
Molecular-level Manipulation Technology for Low-k Dielectrics Controlling the Physical and Chemical Structures toward 32nm-node BEOLs
|
Hayashi, Yoshihiro
|
|
|
1079 |
1 |
|
artikel
|
| 19 |
Nanoindentation of Lead Free Solders for Harsh Environments
|
Vitor, Farinha Marques
|
|
|
1079 |
1 |
|
artikel
|
| 20 |
Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects
|
Aditya, Pradeep Karmarkar
|
|
|
1079 |
1 |
|
artikel
|
| 21 |
Off-Angular Deposition Compensation for PVD Selective Re-sputtering Process
|
Yang, Hsien-Lung
|
|
|
1079 |
1 |
|
artikel
|
| 22 |
Organization of Magnetic/Noble Metal Heterostructures by an Applied External Magnetic Field
|
Pazos-Pérez, Nicolás
|
|
|
1079 |
1 |
|
artikel
|
| 23 |
Patterned wafers backside thinning for 3-D Integration and multilayer stack achievement by direct wafer bonding
|
Charlet, Barbara
|
|
|
1079 |
1 |
|
artikel
|
| 24 |
Pd Segregation at (001) B2-NiSi/Si Epitaxial Interface Studied by Density Functional Theory
|
Kim, Dae-Hee
|
|
|
1079 |
1 |
|
artikel
|
| 25 |
Plasma Modification Of Si-O-Si Bond Structure in Porous Sioch Films
|
Fedor, N. Dultsev
|
|
|
1079 |
1 |
|
artikel
|
| 26 |
Sacrificial Passivation of Nanoscale Metal Powders for Transient Liquid Phase Bonding
|
Nick, S. Bosco
|
|
|
1079 |
1 |
|
artikel
|
| 27 |
Selective Oxidation and Resistivity Reduction of Cu-Mn Alloy Films for Self-forming Barrier Process
|
Iijima, Jun
|
|
|
1079 |
1 |
|
artikel
|
| 28 |
Self-formation of Ti-rich Layers at Cu(Ti)/low-k Interfaces
|
Kohama, Kazuyuki
|
|
|
1079 |
1 |
|
artikel
|
| 29 |
Semiconductor Film Bonding Technology and Application in Two-axis Hall Sensor Fabrication
|
Koh, Keishin
|
|
|
1079 |
1 |
|
artikel
|
| 30 |
TVS Measurements of Metal Ions in Low-k Dielectrics: Effect of H2O Uptake
|
Ciofi, Ivan
|
|
|
1079 |
1 |
|
artikel
|
| 31 |
Using a Barrier Layer to Inhibit Ti/Oxide Reaction to Reduce RC Delay and Improve Electromigration in Al-Cu/Ti/W Interconnect for High Power Analog and Mixed Signal Applications
|
William, J. Murphy
|
|
|
1079 |
1 |
|
artikel
|
| 32 |
UV Curing Effects of Low-k Materials under Reactive Conditions
|
Moore, Darren
|
|
|
1079 |
1 |
|
artikel
|
Tijdschrift beschrijving