|
Extendibility Study of a PVD Cu Seed Process with Ar+ Rf-Plasma Enhanced Coverage for 45nm Interconnects |
|
|
|
Titel: |
Extendibility Study of a PVD Cu Seed Process with Ar+ Rf-Plasma Enhanced Coverage for 45nm Interconnects |
Auteur: |
Andrew, H. Simon Bolom, Tibor Teck, Jung Tang Baker, Brett Peters, Carsten Rhoads, Bryan Philip, L. Flaitz Sankaran, Sujatha Grunow, Stephan |
Verschenen in: |
MRS proceedings |
Paginering: |
Jaargang 1079 () nr. 1 pagina's xx |
Jaar: |
2008-12-01 |
Inhoud: |
|
Uitgever: |
Springer International Publishing, Cham |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|