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                             32 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A microvalve for hybrid microfluidic systems Simone, G.
2009
16 7 p. 1269-1276
artikel
2 A novel CMOS process compatible high performance parallel-stacked RF spiral inductor Jair, D. K.
2009
16 7 p. 1175-1179
artikel
3 Corona discharge assisted thermal bonding of polymer microfluidic devices Ng, Sum Huan
2009
16 7 p. 1181-1186
artikel
4 Design issues of BAW employment in 3D integrated sensor nodes Prainsack, Josef
2009
16 7 p. 1037-1043
artikel
5 Design of CWDM multiplexers based on series coupled ring resonators: analysis, potential and prospects on MEMS fabrication technologies Malak, Maurine
2010
16 7 p. 1139-1156
artikel
6 Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries Marquardt, Krystan
2009
16 7 p. 1119-1129
artikel
7 3D System-on-Chip technologies for More than Moore systems Ramm, Peter
2009
16 7 p. 1051-1055
artikel
8 Effect of dimensional and material property uncertainties on thermal flexure microactuator response using probabilistic methods Khayatzadeh Safaie, Babak
2009
16 7 p. 1081-1090
artikel
9 Effects of channel surface finish on blood flow in microfluidic devices Prentner, S.
2010
16 7 p. 1091-1096
artikel
10 Experimental study of heat sink performance using copper foams fabricated by electroforming Chein, Reiyu
2009
16 7 p. 1157-1164
artikel
11 Fabrication methods based on wet etching process for the realization of silicon MEMS structures with new shapes Pal, Prem
2010
16 7 p. 1165-1174
artikel
12 Fabrication of internally driven micro centrifugal force pumps based on synchronous micro motors Waldschik, Andreas
2010
16 7 p. 1105-1110
artikel
13 Hot punching on an 8 inch substrate as an alternative technology to produce holes on a large scale Rapp, Bastian E.
2009
16 7 p. 1201-1206
artikel
14 Hydrodynamic separation of cells utilizing insulator-based dielectrophoresis Jen, Chun-Ping
2009
16 7 p. 1097-1104
artikel
15 Identification of mechanical defects in MEMS using dynamic measurements for application in production monitoring Gerbach, Ronny
2010
16 7 p. 1251-1257
artikel
16 Integration of stamper fabrication and design optimization of LCD Light guides using silicon-based microfeatures Yu, Jyh-Cheng
2009
16 7 p. 1193-1200
artikel
17 Mechanical modelling of capacitive RF MEMS shunt switches Marcelli, Romolo
2010
16 7 p. 1057-1064
artikel
18 MEMS cantilever sensor for non-destructive metrology within high-aspect-ratio micro holes Peiner, Erwin
2009
16 7 p. 1259-1268
artikel
19 MEMS packaging process by film transfer using an anti-adhesive layer Brault, Sebastien
2010
16 7 p. 1277-1284
artikel
20 Microsystem technologies: foreword to special issue on design, test, integration and packaging of MEMS/MOEMS, 2009 Courtois, Bernard
2010
16 7 p. 1035
artikel
21 Microthermoforming of nanostructured polymer films: a new bonding method for the integration of nanostructures in 3-dimensional cavities Heilig, Markus
2010
16 7 p. 1221-1231
artikel
22 Modeling of an electrostatic torsional micromirror for laser projection system Marchetti, Eleonora
2010
16 7 p. 1073-1079
artikel
23 New fabrication method for micro-pyramidal vertical probe array for probe cards Lin, Tsung-Hung
2009
16 7 p. 1215-1220
artikel
24 Novel design of a RF-MEMS tuneable capacitor based on electrostatically induced torsion Ture Savadkoohi, Parisa
2009
16 7 p. 1187-1192
artikel
25 Novel U-shape gold nanoparticles-modified optical fiber for localized plasmon resonance chemical sensing Chen, Chien-Hsing
2009
16 7 p. 1207-1214
artikel
26 Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS Tong, Chi-Jia
2009
16 7 p. 1131-1137
artikel
27 Optimal design analysis of electrothermally driven microactuators Karbasi, Seyed Majid
2009
16 7 p. 1065-1071
artikel
28 Properties of M-AFM probe affected by nanostructural metal coatings Hosoi, A.
2009
16 7 p. 1233-1237
artikel
29 Reliability of RF MEMS switches due to charging effects and their circuital modelling Marcelli, Romolo
2009
16 7 p. 1111-1118
artikel
30 Temperature dependent fracture toughness of glass frit bonding layers Nötzold, Kerstin
2010
16 7 p. 1243-1249
artikel
31 Through-silicon via technologies for interconnects in RF MEMS Zhu, Jian
2010
16 7 p. 1045-1049
artikel
32 Use of a PDMS spring element for ink jet printing applications Bargir, S.
2009
16 7 p. 1239-1242
artikel
                             32 gevonden resultaten
 
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