| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections
|
Dreßler, M.
|
|
2008
|
15 |
1 |
p. 83-88
|
artikel
|
| 2 |
A silicon test chip for the thermomechanical analysis of MEMS packagings
|
Majcherek, Soeren
|
|
2008
|
15 |
1 |
p. 191-200
|
artikel
|
| 3 |
A simple method for testing the electromigration resistance of solders
|
Saka, M.
|
|
2008
|
15 |
1 |
p. 17-25
|
artikel
|
| 4 |
Assessment of testing methodologies for thin-film vacuum MEMS packages
|
Li, Qian
|
|
2008
|
15 |
1 |
p. 161-168
|
artikel
|
| 5 |
Changes in the microstructure of materials and their impact on reliability: experiments and modeling
|
Brandmair, Andreas
|
|
2008
|
15 |
1 |
p. 201-215
|
artikel
|
| 6 |
Design limitations related to conductive anodic filament formation in a micro-world
|
Caputo, Antonio
|
|
2008
|
15 |
1 |
p. 39-44
|
artikel
|
| 7 |
Distributed BIT diagnostic network Microsystems for miniature mobile robot
|
Xiuli, Yu
|
|
2008
|
15 |
1 |
p. 95-99
|
artikel
|
| 8 |
Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics
|
Yu, Shouwen
|
|
2008
|
15 |
1 |
p. 33-38
|
artikel
|
| 9 |
Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards
|
Lee, J.
|
|
2008
|
15 |
1 |
p. 145-149
|
artikel
|
| 10 |
Exploring the applicability of gradient elasticity to certain micro/nano reliability problems
|
Aifantis, Elias C.
|
|
2008
|
15 |
1 |
p. 109-115
|
artikel
|
| 11 |
Failure modeling of ACA-glued flip-chip on flex assemblies
|
Wunderle, B.
|
|
2008
|
15 |
1 |
p. 3-15
|
artikel
|
| 12 |
Focused ion beam core hole drilling for stress detection in thin-films
|
Gerdes, H.
|
|
2008
|
15 |
1 |
p. 151-153
|
artikel
|
| 13 |
How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments
|
Müller, W. H.
|
|
2008
|
15 |
1 |
p. 45-55
|
artikel
|
| 14 |
Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance
|
Shamshirsaz, M.
|
|
2008
|
15 |
1 |
p. 155-159
|
artikel
|
| 15 |
Interlayer cooling potential in vertically integrated packages
|
Brunschwiler, T.
|
|
2008
|
15 |
1 |
p. 57-74
|
artikel
|
| 16 |
Macroscopic invisible cables
|
Pugno, Nicola M.
|
|
2008
|
15 |
1 |
p. 175-180
|
artikel
|
| 17 |
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
|
Huang, Zhiheng
|
|
2008
|
15 |
1 |
p. 101-107
|
artikel
|
| 18 |
MST Special Issue on the conference MicroNanoReliability 2007
|
Michel, Bernd
|
|
2008
|
15 |
1 |
p. 1
|
artikel
|
| 19 |
Nonsingular dislocation and crack fields: implications to small volumes
|
Kioseoglou, J.
|
|
2008
|
15 |
1 |
p. 117-121
|
artikel
|
| 20 |
Physics of failure for interconnect structures: an essay
|
Tilgner, Rainer
|
|
2008
|
15 |
1 |
p. 129-138
|
artikel
|
| 21 |
Poly-si extensions and etching residues as a reliability risk
|
Jacob, Peter
|
|
2008
|
15 |
1 |
p. 169-174
|
artikel
|
| 22 |
Reliability testing of nano-particle system packaging
|
Morris, James E.
|
|
2008
|
15 |
1 |
p. 139-143
|
artikel
|
| 23 |
Simulations of nanoscale thermal conduction
|
Heino, Pekka
|
|
2008
|
15 |
1 |
p. 75-81
|
artikel
|
| 24 |
Strength of hierarchical materials
|
Carpinteri, Alberto
|
|
2008
|
15 |
1 |
p. 27-31
|
artikel
|
| 25 |
Study on fault diagnostic strategy of intelligent magnetic detection microsystems
|
Wang, Yongqiang
|
|
2008
|
15 |
1 |
p. 89-94
|
artikel
|
| 26 |
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads
|
Fałat, Tomasz
|
|
2008
|
15 |
1 |
p. 181-190
|
artikel
|
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