| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures
|
Truckenmüller, R.
|
|
2004
|
10 |
5 |
p. 372-374
|
artikel
|
| 2 |
Design and simulation of MEMS optical switch using photonic bandgap crystal
|
Teo, H.G.
|
|
2004
|
10 |
5 |
p. 400-406
|
artikel
|
| 3 |
Design, fabrication, and test of a peristaltic micropump
|
Knight, M.
|
|
2004
|
10 |
5 |
p. 426-431
|
artikel
|
| 4 |
Development of a novel self-sensitive atomic force microscope for nondestructive measurement of micro vertical surfaces
|
Kobayashi, T.
|
|
2004
|
10 |
5 |
p. 423-425
|
artikel
|
| 5 |
Dynamic modeling of interactions between fields and matter in MEMS devices
|
Zeng, K.
|
|
2004
|
10 |
5 |
p. 387-392
|
artikel
|
| 6 |
Ensuring repeatability in LIGA mold insert fabrication
|
Schulz, J.
|
|
2004
|
10 |
5 |
p. 419-422
|
artikel
|
| 7 |
Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell
|
Fonseca, L.
|
|
2004
|
10 |
5 |
p. 382-386
|
artikel
|
| 8 |
Fracture behaviour of single crystal silicon microstructures
|
Meroni, F. Favalli
|
|
2004
|
10 |
5 |
p. 412-418
|
artikel
|
| 9 |
Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003
|
Courtois, Bernard
|
|
2004
|
10 |
5 |
p. 345
|
artikel
|
| 10 |
Modular parametric finite element modelling for reliability-studies in electronic and mems packaging
|
Wunderle, B.
|
|
2004
|
10 |
5 |
p. 375-381
|
artikel
|
| 11 |
New aspects of simulation in hot embossing
|
Worgull, M.
|
|
2004
|
10 |
5 |
p. 432-437
|
artikel
|
| 12 |
New electroforming technology pressure aid for LIGA process
|
Tsai, T.-H.
|
|
2004
|
10 |
5 |
p. 351-356
|
artikel
|
| 13 |
Parallel-beams/lever electrothermal out-of-plane actuator
|
Deladi, S.
|
|
2004
|
10 |
5 |
p. 393-399
|
artikel
|
| 14 |
“Plug-up”–a new concept for fabricating SOI MEMS devices
|
Kiihamäki, J.
|
|
2004
|
10 |
5 |
p. 346-350
|
artikel
|
| 15 |
Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process
|
Witvrouw, A.
|
|
2004
|
10 |
5 |
p. 364-371
|
artikel
|
| 16 |
SU8 resist plasma etching and its optimisation
|
Hong, G.
|
|
2004
|
10 |
5 |
p. 357-359
|
artikel
|
| 17 |
Thin film formation on non-planar surface with use of spray coating fabrication
|
Ichiki, M.
|
|
2004
|
10 |
5 |
p. 360-363
|
artikel
|
| 18 |
Yield strength of thin-film parylene-C
|
Shih, C.Y.
|
|
2004
|
10 |
5 |
p. 407-411
|
artikel
|
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