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                             29 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Band Profile Comparison of the Cubic Perovskites CaCoO3 and SrCoO3 Ali, Zahid
2012
42 3 p. 438-444
artikel
2 Comparison of the Microwave Performance of Transparent Wire Monopole Antennas Based on Silver Films Hautcoeur, J.
2012
42 3 p. 552-557
artikel
3 Creation of Yb2O3 Nanoprecipitates Through an Oxidation Process in Bulk Yb-Filled Skutterudites Ding, Juan
2012
42 3 p. 382-388
artikel
4 Cu–Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation Lim, D. F.
2012
42 3 p. 502-506
artikel
5 Development and Status of Cu Ball/Wedge Bonding in 2012 Schneider-Ramelow, Martin
2013
42 3 p. 558-595
artikel
6 Dielectric Tunability of DNA Biopolymer Films with Varying Amounts of Hexadecyltrimethylammonium Chloride Aga, Roberto S.
2012
42 3 p. 463-469
artikel
7 Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer Yang, C.L.
2012
42 3 p. 359-365
artikel
8 Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing Shnawah, Dhafer Abdulameer
2012
42 3 p. 470-484
artikel
9 Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires Chuang, Tung-Han
2012
42 3 p. 545-551
artikel
10 Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films Srivastav, V.
2012
42 3 p. 389-397
artikel
11 Effects of Sintering Temperature on Structure and Properties of 0.997(KNN-LS-BF)-0.003V2O5 Lead-Free Piezoelectric Ceramics Wang, Hua
2012
42 3 p. 458-462
artikel
12 Effects of Solvents in the Polyethylene Glycol Serieson the Bonding of Copper Joints Using Ag2O Paste Takata, Shinya
2012
42 3 p. 507-515
artikel
13 Electrical and Pyroelectric Properties of K2Pb2Gd2W2Ti4Nb4O30 Ferroelectrics Padhee, R.
2012
42 3 p. 426-437
artikel
14 Electrical Characteristics of Thin-Film Transistors Fabricated Utilizing a UV/Ozone-Treated TiO2 Channel Layer Chong, Ho Yong
2012
42 3 p. 398-402
artikel
15 Enhanced Thermoelectric Properties of (PbTe)0.88(PbS)0.12 Composites by Sb Doping Li, J.Q.
2012
42 3 p. 366-371
artikel
16 Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics Xie, H.X.
2012
42 3 p. 527-536
artikel
17 Erratum to: Thermoelectric and Magnetic Properties of Ca0.98RE0.02MnO3-δ (RE = Sm, Gd, and Dy) Bhaskar, Ankam
2012
42 3 p. 597
artikel
18 Erratum to: Thermoelectric Energy Harvesting from Transient Ambient Temperature Gradients Moser, André
2012
42 3 p. 596
artikel
19 Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders Sadiq, Muhammad
2013
42 3 p. 492-501
artikel
20 Improvements in the Sintering Behavior and Microwave Dielectric Properties of Geikielite-Type MgTiO3 Ceramics Wu, H. T.
2012
42 3 p. 445-451
artikel
21 Mechanisms of Creep Deformation in Pure Sn Solder Joints Lee, K. -O.
2012
42 3 p. 516-526
artikel
22 Performance Enhancement of Crystalline Silicon Solar Cells by Coating with Luminescent Silicon Nanostructures Basu, Tuhin Shuvra
2012
42 3 p. 403-409
artikel
23 Phase, Microstructure, and Microwave Dielectric Properties of NaCa4−xSrxNb5O17 (x = 0 to 4) Ceramics Iqbal, Y.
2013
42 3 p. 452-457
artikel
24 Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires Agyakwa, P.A.
2013
42 3 p. 537-544
artikel
25 Screen-Printable Silver Pastes with Nanosized Glass Frits for Silicon Solar Cells Shih, Yu-Chou
2012
42 3 p. 410-416
artikel
26 Thermal Conductivity and ZT in Disordered Organic Thermoelectrics Kwok, H. L.
2012
42 3 p. 355-358
artikel
27 Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module Barako, M. T.
2012
42 3 p. 372-381
artikel
28 The Role of the Nickel Catalyst and Its Chemical and Structural Evolution During Carbon Nanopearl Growth Pacley, S.
2012
42 3 p. 417-425
artikel
29 Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging Chidambaram, Vivek
2012
42 3 p. 485-491
artikel
                             29 gevonden resultaten
 
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