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                                       Details for article 5 of 29 found articles
 
 
  Development and Status of Cu Ball/Wedge Bonding in 2012
 
 
Title: Development and Status of Cu Ball/Wedge Bonding in 2012
Author: Schneider-Ramelow, Martin
Geißler, Ute
Schmitz, Stefan
Grübl, Wolfgang
Schuch, Bernhard
Appeared in: Journal of electronic materials
Paging: Volume 42 (2013) nr. 3 pages 558-595
Year: 2013
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 29 found articles
 
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