| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers
|
Jadhav, Nitin
|
|
2012
|
42 |
2 |
p. 312-318
|
artikel
|
| 2 |
An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints
|
Muralidharan, Govindarajan
|
|
2012
|
42 |
2 |
p. 240-248
|
artikel
|
| 3 |
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD
|
Zhou, Bite
|
|
2012
|
42 |
2 |
p. 319-331
|
artikel
|
| 4 |
Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling
|
Khatibi, G.
|
|
2012
|
42 |
2 |
p. 294-303
|
artikel
|
| 5 |
Conductive Anodic Filament Failures in Fine-PitchThrough-Via Interconnections in Organic Package Substrates
|
Ramachandran, Koushik
|
|
2012
|
42 |
2 |
p. 348-354
|
artikel
|
| 6 |
Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures
|
Mu, Dekui
|
|
2012
|
42 |
2 |
p. 304-311
|
artikel
|
| 7 |
Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints
|
Darbandi, P.
|
|
2012
|
42 |
2 |
p. 201-214
|
artikel
|
| 8 |
Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys
|
Lan, Gong-An
|
|
2012
|
42 |
2 |
p. 249-255
|
artikel
|
| 9 |
Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys
|
McDonald, Stuart
|
|
2012
|
42 |
2 |
p. 256-262
|
artikel
|
| 10 |
Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects
|
Wu, Zhiyong
|
|
2012
|
42 |
2 |
p. 263-271
|
artikel
|
| 11 |
Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)
|
Williams, J.J.
|
|
2012
|
42 |
2 |
p. 224-229
|
artikel
|
| 12 |
Micro- and Nanostructure of Zn Whiskers and Their Coating
|
Etienne, A.
|
|
2012
|
42 |
2 |
p. 272-279
|
artikel
|
| 13 |
Mitigation and Verification Methods for Sn Whisker Growthin Pb-Free Automotive Electronics
|
Hong, Won Sik
|
|
2012
|
42 |
2 |
p. 332-347
|
artikel
|
| 14 |
Physicochemical Properties of Sn-Zn and SAC + Bi Alloys
|
Gancarz, Tomasz
|
|
2012
|
42 |
2 |
p. 288-293
|
artikel
|
| 15 |
Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches
|
Zhao, Ran
|
|
2012
|
42 |
2 |
p. 280-287
|
artikel
|
| 16 |
Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies
|
Tian, Ye
|
|
2012
|
42 |
2 |
p. 230-239
|
artikel
|
| 17 |
The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance
|
Lee, Tae-Kyu
|
|
2012
|
42 |
2 |
p. 215-223
|
artikel
|
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