| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Diffuse Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration
|
Zhou, Peng
|
|
2011
|
40 |
9 |
p. 1867-1875
|
artikel
|
| 2 |
A Sharp Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration
|
Zhou, Peng
|
|
2011
|
40 |
9 |
p. 1876-1883
|
artikel
|
| 3 |
Calculation of the Thermoelectric Power of Vanadium, Niobium, and Tantalum
|
Brodowsky, Horst
|
|
2011
|
40 |
9 |
p. 1984-1989
|
artikel
|
| 4 |
Characterization and Electrochemical Mechanism for Bromide-Containing Conductive Anodic Filament (CAF) Failure
|
Caputo, Antonio
|
|
2011
|
40 |
9 |
p. 1884-1894
|
artikel
|
| 5 |
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
|
Yoon, Jeong-Won
|
|
2011
|
40 |
9 |
p. 1950-1955
|
artikel
|
| 6 |
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects
|
Lee, Tae-Kyu
|
|
2011
|
40 |
9 |
p. 1895-1902
|
artikel
|
| 7 |
Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish
|
Bui, Q. V.
|
|
2011
|
40 |
9 |
p. 1937-1942
|
artikel
|
| 8 |
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100−x-Snx Solders
|
Çadirli, E.
|
|
2011
|
40 |
9 |
p. 1903-1911
|
artikel
|
| 9 |
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
|
Liu, Chao Sheng
|
|
2011
|
40 |
9 |
p. 1912-1920
|
artikel
|
| 10 |
Effects of Solvent Type on Low-Temperature Sintering of Silver Oxide Paste to Form Electrically Conductive Silver Film
|
Kim, Inyoung
|
|
2011
|
40 |
9 |
p. 1977-1983
|
artikel
|
| 11 |
Effects of Thermal Annealing on the Formation of Buried β-SiC by Ion Implantation
|
Poudel, P. R.
|
|
2011
|
40 |
9 |
p. 1998-2003
|
artikel
|
| 12 |
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing
|
Lee, Shang-Hua
|
|
2011
|
40 |
9 |
p. 1943-1949
|
artikel
|
| 13 |
Electron Emission Properties of Surface-Conduction Electron Emitters With a PdO-C-PdO Multilayer Conductive Film Deposited by Magnetron Sputtering
|
Hu, W. B.
|
|
2011
|
40 |
9 |
p. 2020-2026
|
artikel
|
| 14 |
Enhancement of the Stability of Ti and Ni Ohmic Contacts to 4H-SiC with a Stable Protective Coating for Harsh Environment Applications
|
Daves, Walter
|
|
2011
|
40 |
9 |
p. 1990-1997
|
artikel
|
| 15 |
Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder
|
He, Xiaofei
|
|
2011
|
40 |
9 |
p. 1921-1936
|
artikel
|
| 16 |
Hybrid Inorganic–Organic Heterojunction Solar Cell
|
Ebrahim, Shaker
|
|
2011
|
40 |
9 |
p. 2033-2041
|
artikel
|
| 17 |
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects
|
Lee, Tae-Kyu
|
|
2011
|
40 |
9 |
p. 1967-1976
|
artikel
|
| 18 |
Photoluminescence and Raman Spectroscopy of Polycrystalline ZnO Nanofibers Deposited by Electrospinning
|
Sen, Banani
|
|
2011
|
40 |
9 |
p. 2015-2019
|
artikel
|
| 19 |
Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper
|
Chriaštel’ová, J.
|
|
2011
|
40 |
9 |
p. 1956-1961
|
artikel
|
| 20 |
Synthesis and Characterization of Polythiophene/Bi2Te3 Nanocomposite Thermoelectric Material
|
Ao, W. Q.
|
|
2011
|
40 |
9 |
p. 2027-2032
|
artikel
|
| 21 |
Synthesis and Characterization of SrFe11.2Zn0.8O19 Nanoparticles for Enhanced Microwave Absorption
|
Tyagi, Sachin
|
|
2011
|
40 |
9 |
p. 2004-2014
|
artikel
|
| 22 |
Tin Whisker Growth on NdSn3 Powder
|
Shi, Hong-Chang
|
|
2011
|
40 |
9 |
p. 1962-1966
|
artikel
|
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