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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 12 of 22 found articles
| Title: |
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing |
| Author: |
Lee, Shang-Hua Chen, Chih-Ming |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 40 (2011) nr. 9 pages 1943-1949 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 22 found articles
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