| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces
|
Li, Wuhu
|
|
2009
|
39 |
3 |
p. 295-302
|
artikel
|
| 2 |
Current-Induced Interfacial Reactions in Sn Solder Jointswith Electroplated FeNi/Cu Substrate
|
Zhang, X. F.
|
|
2009
|
39 |
3 |
p. 333-337
|
artikel
|
| 3 |
Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints
|
Lin, Yung-Chi
|
|
2009
|
39 |
3 |
p. 283-294
|
artikel
|
| 4 |
Effects of Solder Ball Geometry on Lap Shear Creep Rate
|
Kim, S. B.
|
|
2010
|
39 |
3 |
p. 326-332
|
artikel
|
| 5 |
Enhanced Temperature Stability of (1 − x)(K0.5Na0.5)0.94Li0.06NbO3-x(Bi0.5Na0.5)TiO3 Lead-Free Piezoelectric Ceramics
|
Hao, J. G.
|
|
2009
|
39 |
3 |
p. 347-354
|
artikel
|
| 6 |
Etching of 10Boron with SF6-based Electron Cyclotron Resonance Plasmas for Pillar-Structured Thermal Neutron Detectors
|
Voss, L. F.
|
|
2010
|
39 |
3 |
p. 263-267
|
artikel
|
| 7 |
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)
|
Yang, Ji Chul
|
|
2010
|
39 |
3 |
p. 338-346
|
artikel
|
| 8 |
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy
|
Kaya, H.
|
|
2010
|
39 |
3 |
p. 303-311
|
artikel
|
| 9 |
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
|
Elmer, John W.
|
|
2010
|
39 |
3 |
p. 273-282
|
artikel
|
| 10 |
Modeling of Thermal Conductivity of Graphite Nanosheet Composites
|
Lin, Wei
|
|
2010
|
39 |
3 |
p. 268-272
|
artikel
|
| 11 |
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation
|
Onishi, Takashi
|
|
2010
|
39 |
3 |
p. 318-325
|
artikel
|
| 12 |
Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy
|
Sopoušek, Jir̆í
|
|
2010
|
39 |
3 |
p. 312-317
|
artikel
|
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