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Journal description
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Details for article 12 of 12 found articles
| Title: |
Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy |
| Author: |
Sopoušek, Jir̆í Palcut, Marián Hodúlová, Erika Janovec, Jozef |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 3 pages 312-317 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 12 found articles
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