| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Chemical Vapor Deposition of α-Boron Layers on Silicon for Controlled Nanometer-Deep p+n Junction Formation
|
Sarubbi, Francesco
|
|
2009
|
39 |
2 |
p. 162-173
|
artikel
|
| 2 |
Comparison of Bowing Behaviors Between III–V and II–VI Common-Cation Semiconductor Ternary Alloys
|
Tit, Nacir
|
|
2009
|
39 |
2 |
p. 178-186
|
artikel
|
| 3 |
Compositional and Strain Characterization of Ion-Beam-Synthesized GexSi1−x Thin Films
|
Hossain, K.
|
|
2009
|
39 |
2 |
p. 174-177
|
artikel
|
| 4 |
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints
|
Lin, Hsiu-Jen
|
|
2009
|
39 |
2 |
p. 200-208
|
artikel
|
| 5 |
Evolution of Annealing Twins in Sputtered Cu Films
|
Yoon, C. K.
|
|
2009
|
39 |
2 |
p. 191-199
|
artikel
|
| 6 |
Formation of Hybrid Inorganic/Organic Nanocomposites
|
Basova, Tamara V.
|
|
2009
|
39 |
2 |
p. 145-148
|
artikel
|
| 7 |
Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles
|
Kangooie, M.
|
|
2009
|
39 |
2 |
p. 215-222
|
artikel
|
| 8 |
Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint
|
Kanda, Yoshihiko
|
|
2009
|
39 |
2 |
p. 238-245
|
artikel
|
| 9 |
Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
|
Yu, Chi-Yang
|
|
2009
|
39 |
2 |
p. 230-237
|
artikel
|
| 10 |
Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates
|
Zhu, WenJun
|
|
2009
|
39 |
2 |
p. 209-214
|
artikel
|
| 11 |
Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane
|
Fritz, Nathan
|
|
2009
|
39 |
2 |
p. 149-156
|
artikel
|
| 12 |
Preparation and Characterization of Epitaxial Conductive Nb-SrTiO3 Thin Films on Si Substrates
|
Wang, Chun
|
|
2009
|
39 |
2 |
p. 187-190
|
artikel
|
| 13 |
Preparation and Ferroelectric Properties of Ho3+/Mo6+ Cosubstituted Bi4Ti3O12 Thin Films by Sol–Gel Method
|
Fu, Chengju
|
|
2009
|
39 |
2 |
p. 258-261
|
artikel
|
| 14 |
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
|
Han, Y.D.
|
|
2009
|
39 |
2 |
p. 223-229
|
artikel
|
| 15 |
Thermodynamic Descriptions for the Sn-Te and Pb-Sn-Te Systems
|
Liu, Yajun
|
|
2009
|
39 |
2 |
p. 246-257
|
artikel
|
| 16 |
Using Phosphorus-Doped α-Si Gettering Layers to Improve NILC Poly-Si TFT Performance
|
Wang, Bau-Ming
|
|
2009
|
39 |
2 |
p. 157-161
|
artikel
|
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