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Journal description
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Details for article 14 of 16 found articles
| Title: |
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder |
| Author: |
Han, Y.D. Jing, H.Y. Nai, S.M.L. Xu, L.Y. Tan, C.M. Wei, J. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2009) nr. 2 pages 223-229 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 16 found articles
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