| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
AlGaSb Buffer Layers for Sb-Based Transistors
|
Bennett, Brian R.
|
|
2010
|
39 |
10 |
p. 2196-2202
|
artikel
|
| 2 |
Analysis of Ultraviolet Curing Effect on the Dielectric Constant and Molecular Structure of a Porous Dielectric Film
|
Smith, Ryan Scott
|
|
2010
|
39 |
10 |
p. 2337-2345
|
artikel
|
| 3 |
Dislocation Clustering and Luminescence Nonuniformityin Bulk GaN and Its Homoepitaxial Film
|
Wang, Fuxue
|
|
2009
|
39 |
10 |
p. 2243-2247
|
artikel
|
| 4 |
Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints
|
Liang, S. W.
|
|
2010
|
39 |
10 |
p. 2316-2323
|
artikel
|
| 5 |
Effect of Cooling Rate on Microstructural Homogeneity and Grain Size of n-Type Si-Ge Thermoelectric Alloy by Melt Spinning
|
Zhang, Pan
|
|
2010
|
39 |
10 |
p. 2251-2254
|
artikel
|
| 6 |
Electrically Conductive Thick Film Made from Silver Alkylcarbamates
|
Liu, Jianguo
|
|
2010
|
39 |
10 |
p. 2267-2273
|
artikel
|
| 7 |
Exact Analytical Solution for the Critical Layer Thickness of a Lattice-Mismatched Heteroepitaxial Layer
|
Hadj Belgacem, C.
|
|
2010
|
39 |
10 |
p. 2248-2250
|
artikel
|
| 8 |
High-Performance MWIR/LWIR Dual-Band 640 × 480 HgCdTe/Si FPAs
|
Patten, E. A.
|
|
2010
|
39 |
10 |
p. 2215-2219
|
artikel
|
| 9 |
High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates
|
Takahashi, Toshihide
|
|
2010
|
39 |
10 |
p. 2274-2280
|
artikel
|
| 10 |
Improved Synthesis of Superconducting Carbon-Doped MgB2 Using a Biopolymer for Simultaneous Crystallite Size Control and Chemical Reduction
|
Hall, Simon R.
|
|
2010
|
39 |
10 |
p. 2332-2336
|
artikel
|
| 11 |
In Situ Raman Analysis of a Bulk GaN-Based Schottky Rectifier Under Operation
|
Xu, Hui
|
|
2010
|
39 |
10 |
p. 2237-2242
|
artikel
|
| 12 |
Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM
|
Jee, Y. K.
|
|
2010
|
39 |
10 |
p. 2286-2291
|
artikel
|
| 13 |
Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing
|
Kim, Byoung-Joon
|
|
2010
|
39 |
10 |
p. 2281-2285
|
artikel
|
| 14 |
Large-Scale Synthesis of Graphene Films by Joule-Heating-Induced Chemical Vapor Deposition
|
Lee, Jung Min
|
|
2010
|
39 |
10 |
p. 2190-2195
|
artikel
|
| 15 |
Numerical Modeling of IR-Laser-Irradiated HgCdTe
|
Storebo, Asta Katrine
|
|
2010
|
39 |
10 |
p. 2220-2232
|
artikel
|
| 16 |
Room-Temperature Preparation of High-Transparency Low-Resistivity ITO Films by Ion Beam Sputtering
|
Shen, Jung-Hsiung
|
|
2010
|
39 |
10 |
p. 2352-2358
|
artikel
|
| 17 |
Single-Crystalline Silicon Layer Transfer to a Flexible Substrate Using Wafer Bonding
|
Byun, Ki Yeol
|
|
2010
|
39 |
10 |
p. 2233-2236
|
artikel
|
| 18 |
Study of LDPE/TiO2 and PS/TiO2 Composites as Potential Substrates for Microstrip Patch Antennas
|
Sarmah, Debashis
|
|
2010
|
39 |
10 |
p. 2359-2365
|
artikel
|
| 19 |
Study of Short- and Long-Term Effectiveness of Ammonium Sulfide as Surface Passivation for InAs/GaSb Superlattices Using X-Ray Photoelectron Spectroscopy
|
Banerjee, Koushik
|
|
2010
|
39 |
10 |
p. 2210-2214
|
artikel
|
| 20 |
Study of Surface Treatments on InAs/GaSb Superlattice LWIR Detectors
|
Kutty, M. N.
|
|
2010
|
39 |
10 |
p. 2203-2209
|
artikel
|
| 21 |
Surface-Modified Titania Nanoparticles with Conjugated Polymer for Hybrid Photovoltaic Devices
|
Geng, Hongwei
|
|
2010
|
39 |
10 |
p. 2346-2351
|
artikel
|
| 22 |
The Phenomenology of Ion Implantation-Induced Blistering and Thin-Layer Splitting in Compound Semiconductors
|
Singh, R.
|
|
2010
|
39 |
10 |
p. 2177-2189
|
artikel
|
| 23 |
Thermal Aging Effects on Cu Ball Shear Strength and Cu/Al Intermetallic Growth
|
Amistoso, Jose Omar S.
|
|
2010
|
39 |
10 |
p. 2324-2331
|
artikel
|
| 24 |
Thermodynamic Properties of Liquid Ag-Au-Sn Alloys
|
Hindler, M.
|
|
2010
|
39 |
10 |
p. 2310-2315
|
artikel
|
| 25 |
Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects
|
Cuddalorepatta, Gayatri
|
|
2010
|
39 |
10 |
p. 2292-2309
|
artikel
|
| 26 |
Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation
|
Onishi, Takashi
|
|
2010
|
39 |
10 |
p. 2255-2266
|
artikel
|
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