| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell
|
Meng, Dong Mei
|
|
2007
|
37 |
4 |
p. 429-438
|
artikel
|
| 2 |
Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability
|
Aoyagi, Yasuhiro
|
|
2008
|
37 |
4 |
p. 448-461
|
artikel
|
| 3 |
Characterization of Ge22Sb22Te56 and Sb-Excess Ge15Sb47Te38 Chalcogenide Thin Films for Phase-Change Memory Applications
|
Ryu, Sang-Ouk
|
|
2008
|
37 |
4 |
p. 535-539
|
artikel
|
| 4 |
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
|
Shi, Yaowu
|
|
2007
|
37 |
4 |
p. 507-514
|
artikel
|
| 5 |
Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations
|
An, Rong
|
|
2008
|
37 |
4 |
p. 477-482
|
artikel
|
| 6 |
Direct Fabrication of Fine Gold Patterns from an Aqueous Solution by a UV Laser
|
Senthil Kumaran, Abbu Udaiyar
|
|
2008
|
37 |
4 |
p. 523-526
|
artikel
|
| 7 |
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder
|
Nai, S.M.L.
|
|
2008
|
37 |
4 |
p. 515-522
|
artikel
|
| 8 |
Effect of Oxidation on Indium Solderability
|
Kim, Jongman
|
|
2007
|
37 |
4 |
p. 483-489
|
artikel
|
| 9 |
Equi-Axed Grain Formation in Electrodeposited Sn-Bi
|
Sandnes, E.
|
|
2007
|
37 |
4 |
p. 490-497
|
artikel
|
| 10 |
Foreword
|
Ravindra, N.M.
|
|
2008
|
37 |
4 |
p. 373
|
artikel
|
| 11 |
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing
|
Wu, B.Y.
|
|
2008
|
37 |
4 |
p. 469-476
|
artikel
|
| 12 |
Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys
|
Lin, Shih-Kang
|
|
2008
|
37 |
4 |
p. 498-506
|
artikel
|
| 13 |
Luminescence of Long-Term Ordered Pure and Doped Gallium Phosphide
|
Pyshkin, Sergei
|
|
2008
|
37 |
4 |
p. 388-395
|
artikel
|
| 14 |
Memory Switching Characteristics in Amorphous Ga2Se3 Films
|
Bekheet, A.E.
|
|
2008
|
37 |
4 |
p. 540-544
|
artikel
|
| 15 |
Microwave Performance of AlGaN/GaN High-Electron-Mobility Transistors on Si/SiO2/Poly-SiC Substrates
|
Anderson, T.J.
|
|
2007
|
37 |
4 |
p. 384-387
|
artikel
|
| 16 |
Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices
|
Rivero, Rene D.
|
|
2007
|
37 |
4 |
p. 374-378
|
artikel
|
| 17 |
Morphology of Thick SiC Epitaxial Films Grown by the Physical Vapor Transport Method
|
Wagner, B.P.
|
|
2008
|
37 |
4 |
p. 379-383
|
artikel
|
| 18 |
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process
|
Kim, Bae-Kyun
|
|
2007
|
37 |
4 |
p. 527-534
|
artikel
|
| 19 |
Platinum and Rhodium Silicide–Germanide Optoelectronics
|
Lepselter, M.P.
|
|
2007
|
37 |
4 |
p. 403-416
|
artikel
|
| 20 |
Practical Surface Treatments and Surface Chemistry of n-Type and p-Type GaN
|
Uhlrich, J.J.
|
|
2007
|
37 |
4 |
p. 439-447
|
artikel
|
| 21 |
Relationship of Band-Edge Luminescence to Recombination Lifetime in Silicon Wafers
|
Ahrenkiel, R.K.
|
|
2007
|
37 |
4 |
p. 396-402
|
artikel
|
| 22 |
Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints
|
Bang, W.H.
|
|
2008
|
37 |
4 |
p. 417-428
|
artikel
|
| 23 |
Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive
|
Inoue, Masahiro
|
|
2008
|
37 |
4 |
p. 462-468
|
artikel
|
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