| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias
|
Lee, Kwang-Yong
|
|
2007
|
36 |
2 |
p. 123-128
|
artikel
|
| 2 |
Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint
|
Chen, Chih-Ming
|
|
2007
|
36 |
2 |
p. 168-172
|
artikel
|
| 3 |
Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints
|
Loo, Shane
|
|
2007
|
36 |
2 |
p. 110-116
|
artikel
|
| 4 |
InAlSb/InAs/AlGaSb Quantum Well Heterostructures for High-Electron-Mobility Transistors
|
Bennett, Brian R.
|
|
2007
|
36 |
2 |
p. 99-104
|
artikel
|
| 5 |
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples
|
Yen, Yee-Wen
|
|
2007
|
36 |
2 |
p. 147-158
|
artikel
|
| 6 |
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C
|
Korhonen, Tia-Marje K.
|
|
2007
|
36 |
2 |
p. 173-178
|
artikel
|
| 7 |
Local Melting during Electromigration in Cu Conductor Lines
|
Zhang, H.
|
|
2007
|
36 |
2 |
p. 117-122
|
artikel
|
| 8 |
Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System
|
Yu, H.
|
|
2007
|
36 |
2 |
p. 136-146
|
artikel
|
| 9 |
Structural and Passivative Behaviors of Cu(In) Thin Film
|
Fang, J. S.
|
|
2006
|
36 |
2 |
p. 129-135
|
artikel
|
| 10 |
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing
|
Liang, S.W.
|
|
2007
|
36 |
2 |
p. 159-167
|
artikel
|
| 11 |
Wafer-Lever Hermetic Package with Through-Wafer Interconnects
|
Yu-Chuan, Wang
|
|
2007
|
36 |
2 |
p. 105-109
|
artikel
|
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