| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications
|
Fan, S. H.
|
|
2003
|
32 |
2 |
p. 101-108
|
artikel
|
| 2 |
Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology
|
Huang, Chien-Sheng
|
|
2003
|
32 |
2 |
p. 89-94
|
artikel
|
| 3 |
Electroluminescence and lasing properties of highly Bi-doped PbTe epitaxial layers grown by temperature difference method under controlled vapor pressure
|
Tamura, Wataru
|
|
2003
|
32 |
2 |
p. 39-42
|
artikel
|
| 4 |
Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating
|
Hwang, Chi-Won
|
|
2003
|
32 |
2 |
p. 52-62
|
artikel
|
| 5 |
Palladium as a contact material for InSb semiconductors—The In-Pd-Sb phase diagram
|
Luef, Christoph
|
|
2003
|
32 |
2 |
p. 43-51
|
artikel
|
| 6 |
Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems
|
Studnitzky, Thomas
|
|
2003
|
32 |
2 |
p. 70-80
|
artikel
|
| 7 |
Thermodynamic modeling of the Au-In-Sb ternary system
|
Liu, H. S.
|
|
2003
|
32 |
2 |
p. 81-88
|
artikel
|
| 8 |
The wettability and microstructure of Sn-Zn-RE alloys
|
Wu, C. M. L.
|
|
2003
|
32 |
2 |
p. 63-69
|
artikel
|
| 9 |
Wetting interaction between Sn-Zn-Ag solders and Cu
|
Lin, Kwang-Lung
|
|
2003
|
32 |
2 |
p. 95-100
|
artikel
|
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