nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Analytical modeling of random discrete traps induced threshold voltage fluctuations in double-gate MOSFET with HfO2/SiO2 gate dielectric stack
|
S.R., Sriram |
|
2019 |
99 |
C |
p. 87-95 |
artikel |
2 |
A no-reference error-tolerability test technique for videos via edge and extreme-value checking and its hardware implementation
|
Hsieh, Tong-Yu |
|
2019 |
99 |
C |
p. 1-11 |
artikel |
3 |
A thermally-resilient all-optical network-on-chip
|
Karimi, Roshanak |
|
2019 |
99 |
C |
p. 74-86 |
artikel |
4 |
Atmospheric neutron single event effect test on Xilinx 28 nm system on chip at CSNS-BL09
|
Yang, Weitao |
|
2019 |
99 |
C |
p. 119-124 |
artikel |
5 |
CIRCA: Towards a modular and extensible framework for approximate circuit generation
|
Witschen, Linus |
|
2019 |
99 |
C |
p. 277-290 |
artikel |
6 |
Correctable and uncorrectable errors using large scale DRAM DIMMs in replacement network servers
|
Baeg, Sanghyeon |
|
2019 |
99 |
C |
p. 104-112 |
artikel |
7 |
Degradation of AlInAs/InGaAs/InP quantum cascade lasers due to electrode adhesion failure
|
Pierścińska, D. |
|
2019 |
99 |
C |
p. 113-118 |
artikel |
8 |
Double parallel barrier height behavior of Au/Poly (linoleic acid)-g-poly (methyl methacrylate) (PLiMMA)/n-Si structure
|
Gökçen, Muharrem |
|
2019 |
99 |
C |
p. 132-136 |
artikel |
9 |
Editorial Board
|
|
|
2019 |
99 |
C |
p. ii |
artikel |
10 |
Effect of copper over-pad metallization on reliability of aluminum wire bonds
|
Kawashiro, Fumiyoshi |
|
2019 |
99 |
C |
p. 168-176 |
artikel |
11 |
Experimental determination of critical adhesion energies with the Advanced Button Shear Test
|
Pflügler, Nadine |
|
2019 |
99 |
C |
p. 177-185 |
artikel |
12 |
Failure analysis and process improvement of copper diffusion
|
Yuan, Luyue |
|
2019 |
99 |
C |
p. 291-294 |
artikel |
13 |
In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices
|
Tanner, B.K. |
|
2019 |
99 |
C |
p. 232-238 |
artikel |
14 |
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
|
Bang, Junghwan |
|
2019 |
99 |
C |
p. 62-73 |
artikel |
15 |
Kinematics and reliable analysis of decoupled parallel mechanism for ankle rehabilitation
|
Chang, Ting-Cheng |
|
2019 |
99 |
C |
p. 203-212 |
artikel |
16 |
Life cycle trends of electronic materials, processes and components
|
Huang, Chien-Ming |
|
2019 |
99 |
C |
p. 262-276 |
artikel |
17 |
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
|
Manoharan, Subramani |
|
2019 |
99 |
C |
p. 137-151 |
artikel |
18 |
Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire
|
Qin, Wentao |
|
2019 |
99 |
C |
p. 239-244 |
artikel |
19 |
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
|
Li, Qi-hai |
|
2019 |
99 |
C |
p. 12-18 |
artikel |
20 |
Modeling and detecting approach for the change point of electronic product infant failure rate
|
He, Yihai |
|
2019 |
99 |
C |
p. 222-231 |
artikel |
21 |
Multi-objective optimal design of motion precision for fork robot arm in LCD panel manufacturing process system
|
Kuo, Jian-Long |
|
2019 |
99 |
C |
p. 19-30 |
artikel |
22 |
Numerical simulation of harmful gas distribution in a range hood with an improved flow channel
|
Wu, Wen-Chung |
|
2019 |
99 |
C |
p. 245-261 |
artikel |
23 |
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
|
Chao, Shih-Chieh |
|
2019 |
99 |
C |
p. 161-167 |
artikel |
24 |
Photovoltaics battery module power supply system with CIGS film applied in portable devices
|
Liou, Jian-Chiun |
|
2019 |
99 |
C |
p. 96-103 |
artikel |
25 |
Reliability analysis of complex brain networks based on chaotic time series
|
Sun, Gengxin |
|
2019 |
99 |
C |
p. 295-301 |
artikel |
26 |
Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components
|
Li, Nga Man Jennifa |
|
2019 |
99 |
C |
p. 152-160 |
artikel |
27 |
Scaling and optimisation of lateral super-junction multi-gate MOSFET for high drive current and low specific on-resistance in sub–50 V applications
|
Adenekan, Olujide A. |
|
2019 |
99 |
C |
p. 213-221 |
artikel |
28 |
Sense amplifier offset voltage analysis for both time-zero and time-dependent variability
|
Agbo, Innocent |
|
2019 |
99 |
C |
p. 52-61 |
artikel |
29 |
Shear strength of off-eutectic AuGe joints at high-temperature
|
Larsson, Andreas |
|
2019 |
99 |
C |
p. 31-43 |
artikel |
30 |
Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation
|
Feng, Wei |
|
2019 |
99 |
C |
p. 125-131 |
artikel |
31 |
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
|
Zheng, Zeyang |
|
2019 |
99 |
C |
p. 44-51 |
artikel |
32 |
Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation
|
Wu, Yu-Hsien |
|
2019 |
99 |
C |
p. 186-196 |
artikel |
33 |
The influence of thermal ageing on the flow-stress of copper traces on PCB's
|
Yuile, Adam |
|
2019 |
99 |
C |
p. 197-202 |
artikel |