| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Analytical modeling of random discrete traps induced threshold voltage fluctuations in double-gate MOSFET with HfO2/SiO2 gate dielectric stack
|
S.R., Sriram
|
|
2019
|
99 |
C |
p. 87-95
|
article
|
| 2 |
A no-reference error-tolerability test technique for videos via edge and extreme-value checking and its hardware implementation
|
Hsieh, Tong-Yu
|
|
2019
|
99 |
C |
p. 1-11
|
article
|
| 3 |
A thermally-resilient all-optical network-on-chip
|
Karimi, Roshanak
|
|
2019
|
99 |
C |
p. 74-86
|
article
|
| 4 |
Atmospheric neutron single event effect test on Xilinx 28 nm system on chip at CSNS-BL09
|
Yang, Weitao
|
|
2019
|
99 |
C |
p. 119-124
|
article
|
| 5 |
CIRCA: Towards a modular and extensible framework for approximate circuit generation
|
Witschen, Linus
|
|
2019
|
99 |
C |
p. 277-290
|
article
|
| 6 |
Correctable and uncorrectable errors using large scale DRAM DIMMs in replacement network servers
|
Baeg, Sanghyeon
|
|
2019
|
99 |
C |
p. 104-112
|
article
|
| 7 |
Degradation of AlInAs/InGaAs/InP quantum cascade lasers due to electrode adhesion failure
|
Pierścińska, D.
|
|
2019
|
99 |
C |
p. 113-118
|
article
|
| 8 |
Double parallel barrier height behavior of Au/Poly (linoleic acid)-g-poly (methyl methacrylate) (PLiMMA)/n-Si structure
|
Gökçen, Muharrem
|
|
2019
|
99 |
C |
p. 132-136
|
article
|
| 9 |
Editorial Board
|
|
|
2019
|
99 |
C |
p. ii
|
article
|
| 10 |
Effect of copper over-pad metallization on reliability of aluminum wire bonds
|
Kawashiro, Fumiyoshi
|
|
2019
|
99 |
C |
p. 168-176
|
article
|
| 11 |
Experimental determination of critical adhesion energies with the Advanced Button Shear Test
|
Pflügler, Nadine
|
|
2019
|
99 |
C |
p. 177-185
|
article
|
| 12 |
Failure analysis and process improvement of copper diffusion
|
Yuan, Luyue
|
|
2019
|
99 |
C |
p. 291-294
|
article
|
| 13 |
In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices
|
Tanner, B.K.
|
|
2019
|
99 |
C |
p. 232-238
|
article
|
| 14 |
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate
|
Bang, Junghwan
|
|
2019
|
99 |
C |
p. 62-73
|
article
|
| 15 |
Kinematics and reliable analysis of decoupled parallel mechanism for ankle rehabilitation
|
Chang, Ting-Cheng
|
|
2019
|
99 |
C |
p. 203-212
|
article
|
| 16 |
Life cycle trends of electronic materials, processes and components
|
Huang, Chien-Ming
|
|
2019
|
99 |
C |
p. 262-276
|
article
|
| 17 |
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
|
Manoharan, Subramani
|
|
2019
|
99 |
C |
p. 137-151
|
article
|
| 18 |
Mechanism to improve the reliability of copper wire bonding with palladium-coating of the wire
|
Qin, Wentao
|
|
2019
|
99 |
C |
p. 239-244
|
article
|
| 19 |
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
|
Li, Qi-hai
|
|
2019
|
99 |
C |
p. 12-18
|
article
|
| 20 |
Modeling and detecting approach for the change point of electronic product infant failure rate
|
He, Yihai
|
|
2019
|
99 |
C |
p. 222-231
|
article
|
| 21 |
Multi-objective optimal design of motion precision for fork robot arm in LCD panel manufacturing process system
|
Kuo, Jian-Long
|
|
2019
|
99 |
C |
p. 19-30
|
article
|
| 22 |
Numerical simulation of harmful gas distribution in a range hood with an improved flow channel
|
Wu, Wen-Chung
|
|
2019
|
99 |
C |
p. 245-261
|
article
|
| 23 |
Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds
|
Chao, Shih-Chieh
|
|
2019
|
99 |
C |
p. 161-167
|
article
|
| 24 |
Photovoltaics battery module power supply system with CIGS film applied in portable devices
|
Liou, Jian-Chiun
|
|
2019
|
99 |
C |
p. 96-103
|
article
|
| 25 |
Reliability analysis of complex brain networks based on chaotic time series
|
Sun, Gengxin
|
|
2019
|
99 |
C |
p. 295-301
|
article
|
| 26 |
Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components
|
Li, Nga Man Jennifa
|
|
2019
|
99 |
C |
p. 152-160
|
article
|
| 27 |
Scaling and optimisation of lateral super-junction multi-gate MOSFET for high drive current and low specific on-resistance in sub–50 V applications
|
Adenekan, Olujide A.
|
|
2019
|
99 |
C |
p. 213-221
|
article
|
| 28 |
Sense amplifier offset voltage analysis for both time-zero and time-dependent variability
|
Agbo, Innocent
|
|
2019
|
99 |
C |
p. 52-61
|
article
|
| 29 |
Shear strength of off-eutectic AuGe joints at high-temperature
|
Larsson, Andreas
|
|
2019
|
99 |
C |
p. 31-43
|
article
|
| 30 |
Stress investigation of annular-trench-isolated TSV by polarized Raman spectroscopy measurement and finite element simulation
|
Feng, Wei
|
|
2019
|
99 |
C |
p. 125-131
|
article
|
| 31 |
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
|
Zheng, Zeyang
|
|
2019
|
99 |
C |
p. 44-51
|
article
|
| 32 |
Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation
|
Wu, Yu-Hsien
|
|
2019
|
99 |
C |
p. 186-196
|
article
|
| 33 |
The influence of thermal ageing on the flow-stress of copper traces on PCB's
|
Yuile, Adam
|
|
2019
|
99 |
C |
p. 197-202
|
article
|
Journal description