| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparison of the effects of cobalt-60 γ ray irradiation on DPSA bipolar transistors at high and low injection levels
|
Zhang, Peijian
|
|
2017
|
71 |
C |
p. 86-90
5 p.
|
artikel
|
| 2 |
A statistical study to identify the effects of packaging structures on lumen reliability of LEDs
|
Chen, Qi
|
|
2017
|
71 |
C |
p. 51-55
5 p.
|
artikel
|
| 3 |
Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing
|
Chen, Yilong
|
|
2017
|
71 |
C |
p. 134-142
9 p.
|
artikel
|
| 4 |
Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory
|
Shokravi, M.
|
|
2017
|
71 |
C |
p. 17-28
12 p.
|
artikel
|
| 5 |
Editorial Board
|
|
|
2017
|
71 |
C |
p. IFC-
1 p.
|
artikel
|
| 6 |
Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock
|
Tan, Shihai
|
|
2017
|
71 |
C |
p. 126-133
8 p.
|
artikel
|
| 7 |
Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC
|
Tran, Hiep
|
|
2017
|
71 |
C |
p. 82-85
4 p.
|
artikel
|
| 8 |
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis
|
Yoon, Hyungseok
|
|
2017
|
71 |
C |
p. 41-50
10 p.
|
artikel
|
| 9 |
Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading
|
Xia, Jiang
|
|
2017
|
71 |
C |
p. 111-118
8 p.
|
artikel
|
| 10 |
Fault detection using thermal image based on soft computing methods: Comparative study
|
Al-Obaidy, Furat
|
|
2017
|
71 |
C |
p. 56-64
9 p.
|
artikel
|
| 11 |
Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn
|
Sakamoto, Junji
|
|
2017
|
71 |
C |
p. 29-34
6 p.
|
artikel
|
| 12 |
High-current stressing of organic light-emitting diodes with different electron-transport materials
|
Liu, L.
|
|
2017
|
71 |
C |
p. 106-110
5 p.
|
artikel
|
| 13 |
High cycle fatigue testing of thermosonic ball bonds
|
Lassnig, A.
|
|
2017
|
71 |
C |
p. 91-98
8 p.
|
artikel
|
| 14 |
Improved on-chip self-triggered single-event transient measurement circuit design and applications
|
Chen, Rongmei
|
|
2017
|
71 |
C |
p. 99-105
7 p.
|
artikel
|
| 15 |
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
|
Lee, Byung-Suk
|
|
2017
|
71 |
C |
p. 119-125
7 p.
|
artikel
|
| 16 |
Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects
|
Liang, S.B.
|
|
2017
|
71 |
C |
p. 71-81
11 p.
|
artikel
|
| 17 |
On the short-circuit and avalanche ruggedness reliability assessment of SiC MOSFET modules
|
Ionita, Claudiu
|
|
2017
|
71 |
C |
p. 6-16
11 p.
|
artikel
|
| 18 |
Operational frequency degradation induced trapping in scaled GaN HEMTs
|
Ubochi, Brendan
|
|
2017
|
71 |
C |
p. 35-40
6 p.
|
artikel
|
| 19 |
Self-triggered stacked silicon-controlled rectifier structure (STSSCR) for on-chip electrostatic discharge (ESD) protection
|
Jizhi, Liu
|
|
2017
|
71 |
C |
p. 1-5
5 p.
|
artikel
|
| 20 |
Single event effects sensitivity of low energy proton in Xilinx Zynq-7010 system-on chip
|
Du, Xuecheng
|
|
2017
|
71 |
C |
p. 65-70
6 p.
|
artikel
|
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