nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs
|
Goel, N. |
|
2014 |
54 |
3 |
p. 491-519 29 p. |
artikel |
2 |
A finite state machine based fault tolerance technique for sequential circuits
|
El-Maleh, Aiman H. |
|
2014 |
54 |
3 |
p. 654-661 8 p. |
artikel |
3 |
A journey towards reliability improvement of TiO2 based Resistive Random Access Memory: A review
|
Acharyya, D. |
|
2014 |
54 |
3 |
p. 541-560 20 p. |
artikel |
4 |
A novel partial-SOI LDMOSFET (>800V) with n-type floating buried layer in substrate
|
Xia, Chao |
|
2014 |
54 |
3 |
p. 582-586 5 p. |
artikel |
5 |
A reversible first-order dispersive model of parametric instability
|
Alagi, Filippo |
|
2014 |
54 |
3 |
p. 561-569 9 p. |
artikel |
6 |
Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO2 reduction
|
Kim, Myeongjin |
|
2014 |
54 |
3 |
p. 587-594 8 p. |
artikel |
7 |
Comparison between trap and self-heating induced mobility degradation in AlGaN/GaN HEMTs
|
Kalavagunta, Aditya |
|
2014 |
54 |
3 |
p. 570-574 5 p. |
artikel |
8 |
Corrigendum to “An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors” [Microelectron. Reliab. 53 (4) (2013) 540–543]
|
Ghadiry, M. |
|
2014 |
54 |
3 |
p. 662- 1 p. |
artikel |
9 |
Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices
|
Sinha, Koustav |
|
2014 |
54 |
3 |
p. 610-618 9 p. |
artikel |
10 |
Effect of polyimide baking on bump resistance in flip-chip solder joints
|
Cheng, Hsi-Kuei |
|
2014 |
54 |
3 |
p. 629-632 4 p. |
artikel |
11 |
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure
|
Wang, Xi-Shu |
|
2014 |
54 |
3 |
p. 633-640 8 p. |
artikel |
12 |
Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown
|
Chen, Fen |
|
2014 |
54 |
3 |
p. 529-540 12 p. |
artikel |
13 |
Evaluation of the drop response of handheld electronic products
|
Mattila, T.T. |
|
2014 |
54 |
3 |
p. 601-609 9 p. |
artikel |
14 |
Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature
|
Tan, Yansong |
|
2014 |
54 |
3 |
p. 648-653 6 p. |
artikel |
15 |
Inside front cover - Editorial board
|
|
|
2014 |
54 |
3 |
p. IFC- 1 p. |
artikel |
16 |
Interfacial microstructures and glass strengthening in anodic-bonded Al sheet/glass and sputtered Al film/glass
|
Park, Jong-Keun |
|
2014 |
54 |
3 |
p. 641-647 7 p. |
artikel |
17 |
Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs
|
Zhang, R. |
|
2014 |
54 |
3 |
p. 575-581 7 p. |
artikel |
18 |
Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates
|
Zhang, Jie |
|
2014 |
54 |
3 |
p. 619-628 10 p. |
artikel |
19 |
Novel digitally programmable multiphase voltage controlled oscillator and its stability discussion
|
Jin, Jie |
|
2014 |
54 |
3 |
p. 595-600 6 p. |
artikel |
20 |
Recovery behavior in negative bias temperature instability
|
Yonamoto, Yoshiki |
|
2014 |
54 |
3 |
p. 520-528 9 p. |
artikel |