| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs
|
Goel, N.
|
|
2014
|
54 |
3 |
p. 491-519
29 p.
|
article
|
| 2 |
A finite state machine based fault tolerance technique for sequential circuits
|
El-Maleh, Aiman H.
|
|
2014
|
54 |
3 |
p. 654-661
8 p.
|
article
|
| 3 |
A journey towards reliability improvement of TiO2 based Resistive Random Access Memory: A review
|
Acharyya, D.
|
|
2014
|
54 |
3 |
p. 541-560
20 p.
|
article
|
| 4 |
A novel partial-SOI LDMOSFET (>800V) with n-type floating buried layer in substrate
|
Xia, Chao
|
|
2014
|
54 |
3 |
p. 582-586
5 p.
|
article
|
| 5 |
A reversible first-order dispersive model of parametric instability
|
Alagi, Filippo
|
|
2014
|
54 |
3 |
p. 561-569
9 p.
|
article
|
| 6 |
Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO2 reduction
|
Kim, Myeongjin
|
|
2014
|
54 |
3 |
p. 587-594
8 p.
|
article
|
| 7 |
Comparison between trap and self-heating induced mobility degradation in AlGaN/GaN HEMTs
|
Kalavagunta, Aditya
|
|
2014
|
54 |
3 |
p. 570-574
5 p.
|
article
|
| 8 |
Corrigendum to “An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors” [Microelectron. Reliab. 53 (4) (2013) 540–543]
|
Ghadiry, M.
|
|
2014
|
54 |
3 |
p. 662-
1 p.
|
article
|
| 9 |
Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices
|
Sinha, Koustav
|
|
2014
|
54 |
3 |
p. 610-618
9 p.
|
article
|
| 10 |
Effect of polyimide baking on bump resistance in flip-chip solder joints
|
Cheng, Hsi-Kuei
|
|
2014
|
54 |
3 |
p. 629-632
4 p.
|
article
|
| 11 |
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure
|
Wang, Xi-Shu
|
|
2014
|
54 |
3 |
p. 633-640
8 p.
|
article
|
| 12 |
Electron fluence driven, Cu catalyzed, interface breakdown mechanism for BEOL low-k time dependent dielectric breakdown
|
Chen, Fen
|
|
2014
|
54 |
3 |
p. 529-540
12 p.
|
article
|
| 13 |
Evaluation of the drop response of handheld electronic products
|
Mattila, T.T.
|
|
2014
|
54 |
3 |
p. 601-609
9 p.
|
article
|
| 14 |
Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature
|
Tan, Yansong
|
|
2014
|
54 |
3 |
p. 648-653
6 p.
|
article
|
| 15 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
3 |
p. IFC-
1 p.
|
article
|
| 16 |
Interfacial microstructures and glass strengthening in anodic-bonded Al sheet/glass and sputtered Al film/glass
|
Park, Jong-Keun
|
|
2014
|
54 |
3 |
p. 641-647
7 p.
|
article
|
| 17 |
Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs
|
Zhang, R.
|
|
2014
|
54 |
3 |
p. 575-581
7 p.
|
article
|
| 18 |
Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates
|
Zhang, Jie
|
|
2014
|
54 |
3 |
p. 619-628
10 p.
|
article
|
| 19 |
Novel digitally programmable multiphase voltage controlled oscillator and its stability discussion
|
Jin, Jie
|
|
2014
|
54 |
3 |
p. 595-600
6 p.
|
article
|
| 20 |
Recovery behavior in negative bias temperature instability
|
Yonamoto, Yoshiki
|
|
2014
|
54 |
3 |
p. 520-528
9 p.
|
article
|
Journal description