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                             28 results found
no title author magazine year volume issue page(s) type
1 An approach to “Design for Reliability” in solid state lighting systems at high temperatures Tarashioon, S.
2012
52 5 p. 783-793
11 p.
article
2 A study of large area die bonding materials and their corresponding mechanical and thermal properties Chung, Te-yuan
2012
52 5 p. 872-877
6 p.
article
3 Chip and package-related degradation of high power white LEDs Meneghini, Matteo
2012
52 5 p. 804-812
9 p.
article
4 Development of a thermal resistance model for chip-on-board packaging of high power LED arrays Ha, Minseok
2012
52 5 p. 836-844
9 p.
article
5 Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology Horng, Ray-Hua
2012
52 5 p. 818-821
4 p.
article
6 Heat dissipation design and analysis of high power LED array using the finite element method Cheng, Hui Huang
2012
52 5 p. 905-911
7 p.
article
7 Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts Jeng, Ming-Jer
2012
52 5 p. 884-888
5 p.
article
8 High power LED package with vertical structure Lin, Ming-Te
2012
52 5 p. 878-883
6 p.
article
9 Improvement of emission efficiency and color rendering of high-power LED by controlling size of phosphor particles and utilization of different phosphors Chen, Lei
2012
52 5 p. 900-904
5 p.
article
10 Improvement of lumen efficiency in white light-emitting diodes with air-gap embedded package Chen, H.C.
2012
52 5 p. 933-936
4 p.
article
11 Improvement of thermal management of high-power GaN-based light-emitting diodes Liou, Bo-Hung
2012
52 5 p. 861-865
5 p.
article
12 Inside front cover - Editorial board 2012
52 5 p. IFC-
1 p.
article
13 Investigation of dynamic color deviation mechanisms of high power light-emitting diode Fu, Han-Kuei
2012
52 5 p. 866-871
6 p.
article
14 Life prediction of LED-based recess downlight cooled by synthetic jet Song, Bong-Min
2012
52 5 p. 937-948
12 p.
article
15 Light degradation test and design of thermal performance for high-power light-emitting diodes Su, Yen-Fu
2012
52 5 p. 794-803
10 p.
article
16 Light emitting diodes reliability review Chang, Moon-Hwan
2012
52 5 p. 762-782
21 p.
article
17 Maintenance of stable light emission in high power LEDs Chou, Hung-Yu
2012
52 5 p. 912-915
4 p.
article
18 Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests Wang, Jau-Sheng
2012
52 5 p. 813-817
5 p.
article
19 Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package Yang, C.T.
2012
52 5 p. 855-860
6 p.
article
20 Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches Zhang, Rong
2012
52 5 p. 922-932
11 p.
article
21 Optical design of a Butterfly lens for a street light based on a double-cluster LED Lo, Yi-Chien
2012
52 5 p. 889-893
5 p.
article
22 Optimized semi-sphere lens design for high power LED package Hsu, Hsun-Ching
2012
52 5 p. 894-899
6 p.
article
23 Reliability of high-power LED packaging and assembly Liu, Cheng-Yi
2012
52 5 p. 761-
1 p.
article
24 Strength determination of high-power LED die using point-load and line-load tests Chen, C.H.
2012
52 5 p. 822-829
8 p.
article
25 Thermal investigation of LED lighting module Choi, Jong Hwa
2012
52 5 p. 830-835
6 p.
article
26 Thermal measurements and analyses of low-cost high-power LED packages and their modules Tsai, M.Y.
2012
52 5 p. 845-854
10 p.
article
27 Vertical InGaN light-emitting diodes with Ag paste as bonding layer Yang, Y.C.
2012
52 5 p. 949-951
3 p.
article
28 Wafer-level LED-SiP based mobile flash module and characterization Lin, Jyh-Rong
2012
52 5 p. 916-921
6 p.
article
                             28 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands