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Journal description
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Details for article 2 of 28 found articles
| Title: |
A study of large area die bonding materials and their corresponding mechanical and thermal properties |
| Author: |
Chung, Te-yuan Jhang, Jian-Hong Chen, Jing-Sian Lo, Yi-Chien Ho, Gwo-Herng Wu, Mount-Learn Sun, Ching-Cherng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 5 pages 6 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 28 found articles
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