| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An approach to “Design for Reliability” in solid state lighting systems at high temperatures
|
Tarashioon, S.
|
|
2012
|
52 |
5 |
p. 783-793
11 p.
|
artikel
|
| 2 |
A study of large area die bonding materials and their corresponding mechanical and thermal properties
|
Chung, Te-yuan
|
|
2012
|
52 |
5 |
p. 872-877
6 p.
|
artikel
|
| 3 |
Chip and package-related degradation of high power white LEDs
|
Meneghini, Matteo
|
|
2012
|
52 |
5 |
p. 804-812
9 p.
|
artikel
|
| 4 |
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
|
Ha, Minseok
|
|
2012
|
52 |
5 |
p. 836-844
9 p.
|
artikel
|
| 5 |
Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology
|
Horng, Ray-Hua
|
|
2012
|
52 |
5 |
p. 818-821
4 p.
|
artikel
|
| 6 |
Heat dissipation design and analysis of high power LED array using the finite element method
|
Cheng, Hui Huang
|
|
2012
|
52 |
5 |
p. 905-911
7 p.
|
artikel
|
| 7 |
Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts
|
Jeng, Ming-Jer
|
|
2012
|
52 |
5 |
p. 884-888
5 p.
|
artikel
|
| 8 |
High power LED package with vertical structure
|
Lin, Ming-Te
|
|
2012
|
52 |
5 |
p. 878-883
6 p.
|
artikel
|
| 9 |
Improvement of emission efficiency and color rendering of high-power LED by controlling size of phosphor particles and utilization of different phosphors
|
Chen, Lei
|
|
2012
|
52 |
5 |
p. 900-904
5 p.
|
artikel
|
| 10 |
Improvement of lumen efficiency in white light-emitting diodes with air-gap embedded package
|
Chen, H.C.
|
|
2012
|
52 |
5 |
p. 933-936
4 p.
|
artikel
|
| 11 |
Improvement of thermal management of high-power GaN-based light-emitting diodes
|
Liou, Bo-Hung
|
|
2012
|
52 |
5 |
p. 861-865
5 p.
|
artikel
|
| 12 |
Inside front cover - Editorial board
|
|
|
2012
|
52 |
5 |
p. IFC-
1 p.
|
artikel
|
| 13 |
Investigation of dynamic color deviation mechanisms of high power light-emitting diode
|
Fu, Han-Kuei
|
|
2012
|
52 |
5 |
p. 866-871
6 p.
|
artikel
|
| 14 |
Life prediction of LED-based recess downlight cooled by synthetic jet
|
Song, Bong-Min
|
|
2012
|
52 |
5 |
p. 937-948
12 p.
|
artikel
|
| 15 |
Light degradation test and design of thermal performance for high-power light-emitting diodes
|
Su, Yen-Fu
|
|
2012
|
52 |
5 |
p. 794-803
10 p.
|
artikel
|
| 16 |
Light emitting diodes reliability review
|
Chang, Moon-Hwan
|
|
2012
|
52 |
5 |
p. 762-782
21 p.
|
artikel
|
| 17 |
Maintenance of stable light emission in high power LEDs
|
Chou, Hung-Yu
|
|
2012
|
52 |
5 |
p. 912-915
4 p.
|
artikel
|
| 18 |
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests
|
Wang, Jau-Sheng
|
|
2012
|
52 |
5 |
p. 813-817
5 p.
|
artikel
|
| 19 |
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package
|
Yang, C.T.
|
|
2012
|
52 |
5 |
p. 855-860
6 p.
|
artikel
|
| 20 |
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
|
Zhang, Rong
|
|
2012
|
52 |
5 |
p. 922-932
11 p.
|
artikel
|
| 21 |
Optical design of a Butterfly lens for a street light based on a double-cluster LED
|
Lo, Yi-Chien
|
|
2012
|
52 |
5 |
p. 889-893
5 p.
|
artikel
|
| 22 |
Optimized semi-sphere lens design for high power LED package
|
Hsu, Hsun-Ching
|
|
2012
|
52 |
5 |
p. 894-899
6 p.
|
artikel
|
| 23 |
Reliability of high-power LED packaging and assembly
|
Liu, Cheng-Yi
|
|
2012
|
52 |
5 |
p. 761-
1 p.
|
artikel
|
| 24 |
Strength determination of high-power LED die using point-load and line-load tests
|
Chen, C.H.
|
|
2012
|
52 |
5 |
p. 822-829
8 p.
|
artikel
|
| 25 |
Thermal investigation of LED lighting module
|
Choi, Jong Hwa
|
|
2012
|
52 |
5 |
p. 830-835
6 p.
|
artikel
|
| 26 |
Thermal measurements and analyses of low-cost high-power LED packages and their modules
|
Tsai, M.Y.
|
|
2012
|
52 |
5 |
p. 845-854
10 p.
|
artikel
|
| 27 |
Vertical InGaN light-emitting diodes with Ag paste as bonding layer
|
Yang, Y.C.
|
|
2012
|
52 |
5 |
p. 949-951
3 p.
|
artikel
|
| 28 |
Wafer-level LED-SiP based mobile flash module and characterization
|
Lin, Jyh-Rong
|
|
2012
|
52 |
5 |
p. 916-921
6 p.
|
artikel
|
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