nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A MEMS-based wireless multisensor module for environmental monitoring
|
Hautefeuille, Mathieu |
|
2008 |
48 |
6 |
p. 906-910 5 p. |
artikel |
2 |
An approach of numerical multi-objective optimization in stacked packaging
|
Dowhań, Łukasz |
|
2008 |
48 |
6 |
p. 851-857 7 p. |
artikel |
3 |
Anomalous narrow width effect in p-channel metal–oxide–semiconductor surface channel transistors using shallow trench isolation technology
|
Lau, W.S. |
|
2008 |
48 |
6 |
p. 919-922 4 p. |
artikel |
4 |
Calendar
|
|
|
2008 |
48 |
6 |
p. I-III nvt p. |
artikel |
5 |
Design of metal interconnects for stretchable electronic circuits
|
Gonzalez, Mario |
|
2008 |
48 |
6 |
p. 825-832 8 p. |
artikel |
6 |
3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
|
Liu, Yong |
|
2008 |
48 |
6 |
p. 811-824 14 p. |
artikel |
7 |
Electro-ultrasonic spectroscopy of polymer-based thick film layers
|
Sedlakova, Vlasta |
|
2008 |
48 |
6 |
p. 886-889 4 p. |
artikel |
8 |
Evaluation of conductive-to-resistive layers interaction in thick-film resistors
|
Mleczko, K. |
|
2008 |
48 |
6 |
p. 881-885 5 p. |
artikel |
9 |
Evaluation of test methods for silicon die strength
|
Tsai, M.Y. |
|
2008 |
48 |
6 |
p. 933-941 9 p. |
artikel |
10 |
Failure analysis of contact probe pins for SnPb and Sn applications
|
Jang, Changsoo |
|
2008 |
48 |
6 |
p. 942-947 6 p. |
artikel |
11 |
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
|
Wymysłowski, Artur |
|
2008 |
48 |
6 |
p. 803-804 2 p. |
artikel |
12 |
IMAPS Poland 2007 – Guest Editorial
|
Dziedzic, Andrzej |
|
2008 |
48 |
6 |
p. 859- 1 p. |
artikel |
13 |
Inside front cover - Editorial board
|
|
|
2008 |
48 |
6 |
p. IFC- 1 p. |
artikel |
14 |
Investigation on a new silver photoimageable conductor
|
Jakubowska, Małgorzata |
|
2008 |
48 |
6 |
p. 860-865 6 p. |
artikel |
15 |
Microchannel fabrication process in LTCC ceramics
|
Malecha, Karol |
|
2008 |
48 |
6 |
p. 866-871 6 p. |
artikel |
16 |
Microsystems elements based on free-standing thick-films made with a new sacrificial layer process
|
Lucat, Claude |
|
2008 |
48 |
6 |
p. 872-875 4 p. |
artikel |
17 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
6 |
p. 955-956 2 p. |
artikel |
18 |
[No title]
|
Stojcev, Mile |
|
2008 |
48 |
6 |
p. 953-954 2 p. |
artikel |
19 |
Optimisation of a thick-film 10–400N force sensor
|
Maeder, Thomas |
|
2008 |
48 |
6 |
p. 902-905 4 p. |
artikel |
20 |
Piezoelectric polymer films as power converters for human powered electronics
|
Klimiec, Ewa |
|
2008 |
48 |
6 |
p. 897-901 5 p. |
artikel |
21 |
Planar and three-dimensional thick-film thermoelectric microgenerators
|
Markowski, Piotr |
|
2008 |
48 |
6 |
p. 890-896 7 p. |
artikel |
22 |
Problem of dynamic change of tags location in anticollision RFID systems
|
Jankowski-Mihulowicz, Piotr |
|
2008 |
48 |
6 |
p. 911-918 8 p. |
artikel |
23 |
Quality factor measurement of micro gyroscope structure according to vacuum level and desired Q-factor range package method
|
Kim, Jong-Seok |
|
2008 |
48 |
6 |
p. 948-952 5 p. |
artikel |
24 |
Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges
|
Koganemaru, Masaaki |
|
2008 |
48 |
6 |
p. 923-932 10 p. |
artikel |
25 |
Study of temperature dependent properties of organic substrate materials
|
Boehme, Bjoern |
|
2008 |
48 |
6 |
p. 876-880 5 p. |
artikel |
26 |
The effect of downscaling the dimensions of solder interconnects on their creep properties
|
Wiese, S. |
|
2008 |
48 |
6 |
p. 843-850 8 p. |
artikel |
27 |
The need for multi-scale approaches in Cu/low-k reliability issues
|
Yuan, Cadmus A. |
|
2008 |
48 |
6 |
p. 833-842 10 p. |
artikel |
28 |
Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method
|
Zhou, Jiang |
|
2008 |
48 |
6 |
p. 805-810 6 p. |
artikel |