| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fast mechanical test technique for life time estimation of micro-joints
|
Khatibi, G.
|
|
2008
|
48 |
11-12 |
p. 1822-1830
9 p.
|
artikel
|
| 2 |
A low power MEMS gas sensor based on nanocrystalline ZnO thin films for sensing methane
|
Bhattacharyya, P.
|
|
2008
|
48 |
11-12 |
p. 1772-1779
8 p.
|
artikel
|
| 3 |
An automated approach for locating multiple faulty LUTs in an FPGA
|
Nandha Kumar, T.
|
|
2008
|
48 |
11-12 |
p. 1900-1906
7 p.
|
artikel
|
| 4 |
A novel approach to characterization of progressive breakdown in high-k/metal gate stacks
|
Pagano, R.
|
|
2008
|
48 |
11-12 |
p. 1759-1764
6 p.
|
artikel
|
| 5 |
A review of board level solder joints for mobile applications
|
Wong, E.H.
|
|
2008
|
48 |
11-12 |
p. 1747-1758
12 p.
|
artikel
|
| 6 |
Calendar
|
|
|
2008
|
48 |
11-12 |
p. I-II
nvt p.
|
artikel
|
| 7 |
Consideration of temperature and current stress testing on flip chip solder interconnects
|
Yeo, Alfred
|
|
2008
|
48 |
11-12 |
p. 1847-1856
10 p.
|
artikel
|
| 8 |
Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system
|
Wang, Ying
|
|
2008
|
48 |
11-12 |
p. 1800-1803
4 p.
|
artikel
|
| 9 |
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
|
Kim, Jong-Woong
|
|
2008
|
48 |
11-12 |
p. 1882-1889
8 p.
|
artikel
|
| 10 |
Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology
|
Chiang, Y.T.
|
|
2008
|
48 |
11-12 |
p. 1786-1790
5 p.
|
artikel
|
| 11 |
Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
|
Sen, Banani
|
|
2008
|
48 |
11-12 |
p. 1765-1768
4 p.
|
artikel
|
| 12 |
Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint
|
Yoon, Jeong-Won
|
|
2008
|
48 |
11-12 |
p. 1864-1874
11 p.
|
artikel
|
| 13 |
Electrical characteristics of MOSFETs with La2O3/Y2O3 gate stack
|
Ahmet, Parhat
|
|
2008
|
48 |
11-12 |
p. 1769-1771
3 p.
|
artikel
|
| 14 |
Finite element model verification for packaged printed circuit board by experimental modal analysis
|
Lee, Ying-Chih
|
|
2008
|
48 |
11-12 |
p. 1837-1846
10 p.
|
artikel
|
| 15 |
Improved sensing characteristics of MISiC Schottky-diode hydrogen sensor by using HfO2 as gate insulator
|
Tang, W.M.
|
|
2008
|
48 |
11-12 |
p. 1780-1785
6 p.
|
artikel
|
| 16 |
Improved upper contacts PMMA on P3HT PTFTS using photolithographic processes
|
Mejia, I.
|
|
2008
|
48 |
11-12 |
p. 1795-1799
5 p.
|
artikel
|
| 17 |
Influence of underfill materials on the reliability of coreless flip chip package
|
Chuang, Chun-Chih
|
|
2008
|
48 |
11-12 |
p. 1875-1881
7 p.
|
artikel
|
| 18 |
Inside front cover - Editorial board
|
|
|
2008
|
48 |
11-12 |
p. IFC-
1 p.
|
artikel
|
| 19 |
Investigation of charge trapping/de-trapping induced operation lifetime degradation in triple SuperFlash® memory cell
|
Cao, Zigui
|
|
2008
|
48 |
11-12 |
p. 1809-1814
6 p.
|
artikel
|
| 20 |
Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method
|
Yoon, Jeong-Won
|
|
2008
|
48 |
11-12 |
p. 1857-1863
7 p.
|
artikel
|
| 21 |
Model for life prediction of fatigue–creep interaction
|
Valentín, R.
|
|
2008
|
48 |
11-12 |
p. 1831-1836
6 p.
|
artikel
|
| 22 |
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes
|
Goswami, Arindam
|
|
2008
|
48 |
11-12 |
p. 1815-1821
7 p.
|
artikel
|
| 23 |
Self-testing of fully differential multistage circuits using common-mode excitation
|
Toczek, Wojciech
|
|
2008
|
48 |
11-12 |
p. 1890-1899
10 p.
|
artikel
|
| 24 |
Significantly improving sub-90nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer
|
Hsu, Chia-Wei
|
|
2008
|
48 |
11-12 |
p. 1791-1794
4 p.
|
artikel
|
| 25 |
The degradation mechanisms in high voltage pLEDMOS transistor with thick gate oxide
|
Wu, Hong
|
|
2008
|
48 |
11-12 |
p. 1804-1808
5 p.
|
artikel
|
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